Photoresist UV Precuring for Bubble-Free MO Spacer Etching
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Solution Overview
Problem
The formation of unwanted bubble defects during the spacer etch process in semiconductor manufacturing, particularly when using metal oxide (MO) spacers, limits the scalability and effectiveness of techniques like Self-Aligned Quadruple Patterning (SAQP) and Self-Aligned Double Patterning (SADP).
Innovation Solution
A precuring or pre-exposure operation is performed by exposing the photoresist (PR) layer to ultraviolet (UV) light before depositing or etching a MO layer, which helps in reducing the formation of bubble defects by making the PR layer immune to further UV exposure during the MO deposition or etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a MO layer is deposited or etched onto a photoresist layer during spacer etch process, then spacer features are formed for multi-patterning, but bubble defects are generated on the photoresist layer
Solution Approach 1:
The photoresist layer is precured by exposing it to UV light before the MO layer deposition or etching process. This preliminary curing action modifies the photoresist properties in advance, making it resistant to bubble defect formation during subsequent processing steps while maintaining its ability to form precise spacer features
Solution Approach 2:
The UV exposure precuring changes the physical and chemical parameters of the photoresist layer, such as crosslinking density and thermal stability, which prevents bubble formation during MO layer processing without affecting the spacer pattern fidelity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method significantly reduces or eliminates the occurrence of bubble defects, thereby enhancing the scalability and efficiency of MO-based spacer technologies in semiconductor manufacturing, such as SAQP and SADP.
Implementation Method 1
A precuring or pre-exposure operation is performed by exposing the photoresist (PR) layer to ultraviolet (UV) light before depositing or etching a MO layer
Data Source
AI summary
In some examples, a method of processing a substrate comprises applying a photoresist (PR) onto a surface of the substrate, pre-exposing the PR to ultra violet (UV) light before depositing or etching a metal oxide (MO) layer onto the PR, and depositing or etching a MO layer onto the PR subsequent to pre-exposing the PR to UV light.