Photosensitive Adhesive Layer for Flexible Panel Substrate Separation
Solution Overview
Problem
The manufacturing process of flexible OLED modules is hindered by the strong adhesion between rigid and flexible substrates, making it difficult to separate them after device preparation, leading to a high defective ratio.
Innovation Solution
A method involving the formation of a photosensitive layer, a scattering layer, and a UV blocking layer on a substrate, followed by irradiation with UV rays to reduce the peeling strength, allowing for the easy separation of the scattering layer from the substrate, using epoxy-terminated polysiloxane or silicone as the photosensitive adhesive and titanium dioxide for the scattering layer, and polyimide or PMMA for the flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the rigid substrate and flexible substrate are bonded together with high adhesion, then the structural stability is improved, but the separation difficulty increases
Solution Approach 1:
The patent introduces an intermediate layer between the rigid substrate and flexible substrate, segmenting the bonding interface into multiple functional layers. This intermediate layer contains a photosensitive adhesive that can be selectively deactivated, allowing the system to maintain strong bonding during fabrication but enable easy separation when needed, thus resolving the contradiction between structural stability and separation ease.
Solution Approach 2:
The patent utilizes photosensitive adhesive whose bonding parameters can be changed through UV irradiation. The adhesive transitions from a high-bonding-state to a low-bonding-state upon UV exposure, enabling the system to dynamically adjust the adhesion strength. This parameter change allows strong bonding during manufacturing while facilitating easy separation afterward, resolving the contradiction between structural stability and separation difficulty.
2Manufacturing precision
If the rigid substrate and flexible substrate are tightly adhered, then the manufacturing precision is improved, but the defective ratio increases due to separation difficulty
Solution Approach 1:
The patent incorporates a photosensitive adhesive layer that is prepared in advance with specific properties enabling both strong initial bonding for precision manufacturing and subsequent controllable separation. The adhesive is formulated to provide high adhesion during the manufacturing process to ensure manufacturing precision, while its photosensitive nature allows for easy separation afterward to prevent defects, thus resolving the contradiction between manufacturing precision and defective ratio.
Solution Approach 2:
The photosensitive adhesive layer serves as an intermediary between the rigid and flexible substrates. This intermediary provides the necessary adhesion for precise manufacturing while containing the capability for controlled separation. The intermediate layer absorbs the conflict between needing strong bonding for precision and needing easy separation to avoid defects, thereby resolving the contradiction between manufacturing precision and defective ratio.
3Ease of operation
If a photosensitive adhesive layer is introduced between substrates, then the separation ease is improved, but the device complexity increases
Solution Approach 1:
The photosensitive adhesive layer is formulated to automatically respond to UV irradiation by changing its bonding properties. This self-service mechanism eliminates the need for complex external separation systems or additional active components. The adhesive itself performs the separation function when exposed to UV light, providing easy separation without significantly increasing device complexity, thus resolving the contradiction between separation ease and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, enhances the yield rate of flexible panels, and facilitates the separation of substrates, reducing defects and improving operational ease.
Implementation Method 1
irradiating the photosensitive layer from one side of the substrate by UV rays such that a peeling strength of the photosensitive layer being reduced
Data Source
AI summary
The present disclosure relates to a flexible panel and the manufacturing method thereof. The method includes: coating photosensitive adhesive on a substrate to form a photosensitive layer; forming a scattering layer and an ultraviolet (UV) blocking layer on the photosensitive layer in sequence; forming a flexible substrate layer on the UV blocking layer; forming electronic components, lighting components, and an encapsulation layer on the flexible substrate layer in sequence; and irradiating the photosensitive layer from one side of the substrate by UV rays such that a peeling strength of the photosensitive layer being reduced, and the scattering layer being separated from the substrate to form the flexible panel. By configuring the photosensitive layer, the scattering layer, and the UV blocking layer on the substrate, the scattering layer may be easily separated from the substrate.