Photosensitive Adhesive Composition for Low-Temperature Semiconductor Patterning
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Solution Overview
Problem
Current adhesive compositions for semiconductor devices and flexible displays require high-temperature heating steps, limiting their use in processes like electrode junction formation and thin-film transistor formation, and lack photosensitivity for patterning.
Innovation Solution
A photosensitive adhesive composition comprising a polymer with specific terminal structures and carboxy or hydroxy groups, combined with a radical photopolymerization initiator, allowing for patterning without high-temperature heating through a lithography process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesive compositions (acrylic resin, epoxy resin, silicone resin) are used, then adhesion is achieved, but high-temperature heating steps (250°C or higher) are required which limit their use in processes like electrode junction formation and thin-film transistor formation
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesive by using a polymer with specifically designed terminal structures (formula 1 and formula 2) that enable lower-curing-temperature chemistry, allowing the adhesive to cure effectively at temperatures below 250°C while maintaining strong adhesion properties
Solution Approach 2:
The invention creates a composite adhesive system combining a polymer with specific terminal structures (formula 1 and formula 2), a radical photopolymerization initiator, and a solvent, where the synergistic interaction between components enables both low-temperature curing and high adhesion performance
2Ease of manufacture
If conventional adhesive compositions are used, then adhesion is achieved, but photosensitivity for patterning by lithography process is not available
Solution Approach 1:
The invention introduces a radical photopolymerization initiator as an intermediary substance that enables the adhesive to respond to light exposure, allowing lithography-based patterning while the initiator itself decomposes during the process to facilitate curing
Solution Approach 2:
The adhesive composition is designed to perform multiple functions: providing adhesion, enabling photopatterning through lithography, and achieving crosslinking cure, all within a single composition system that integrates the polymer, photopolymerization initiator, and solvent
3Strength
If the content by mass of polymer (B) with carboxy or hydroxy groups is made larger than polymer (A) with specific terminal structure, then adhesion force and solvent resistance are improved, but the composition must maintain photosensitivity
Solution Approach 1:
The invention applies local quality by having different polymer components serve specialized functions: polymer (A) with specific terminal structures provides the base adhesive properties and crosslinking capability, while polymer (B) with carboxy or hydroxy groups enhances adhesion force and solvent resistance at the interface, with the photopolymerization initiator localized to enable photosensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent solvent resistance, vapor transmission prevention, and high adhesion force, enabling its use in semiconductor elements, MEMS, NEMS, organic EL displays, and image sensors without the need for high-temperature processing.
Implementation Method 1
a radical photopolymerization initiator
Data Source
AI summary
A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A),(wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.)