Photosensitive Adhesive Composition for Semiconductor Wafer Sealing
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Solution Overview
Problem
Conventional photosensitive adhesive compositions used in semiconductor packaging lack sufficient airtight sealing properties, particularly when exposed to high temperature and high humidity environments, leading to dew condensation issues that affect the accuracy of solid-state imaging elements like CMOS sensors.
Innovation Solution
A photosensitive adhesive composition with a storage elastic modulus of at least 10 MPa at 110°C after exposure and heat curing, which enables thermal press bondability and alkali development, ensuring effective airtight sealing by suppressing molecular motion in crosslinked products and reducing moisture permeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive adhesive composition is used for pattern formation, then adhesion properties and thermal press bondability are achieved, but airtight sealing properties are insufficient under high temperature and humidity conditions
Solution Approach 1:
The patent modifies the molecular structure of the photosensitive adhesive composition by incorporating specific compounds (compounds 1-4) with particular functional groups and molecular weights. This changes the physical and chemical parameters of the adhesive, resulting in a storage elastic modulus of at least 10 MPa at 110°C after exposure and heat curing, which provides sufficient airtight sealing properties while preventing dew condensation under high temperature and humidity conditions.
Solution Approach 2:
The patent creates a composite photosensitive adhesive system by combining specific compounds (compounds 1-4) with photoinitiators and other adhesive components. This composite material approach allows the adhesive to simultaneously achieve thermal press bondability, adhesion properties, and enhanced airtight sealing properties that prevent dew condensation in semiconductor packages under harsh environmental conditions.
2Manufacturing precision
If highly fine adhesive pattern is formed with small adhesion area, then pattern precision is improved, but airtight sealing properties deteriorate
Solution Approach 1:
The patent changes the rheological and mechanical parameters of the photosensitive adhesive by selecting compounds with specific molecular weights (500-500,000) and functional groups. This enables the adhesive to maintain high storage elastic modulus (≥10 MPa at 110°C) that ensures airtight sealing even when the adhesive pattern has small adhesion area, thus resolving the contradiction between pattern precision and sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides enhanced airtight sealing properties, maintaining the integrity of semiconductor devices even under high temperature and humidity conditions, preventing dew condensation and ensuring accurate image recognition and display.
Implementation Method 1
a photoinitiator which generates radicals by irradiation with UV light; an unsaturated compound which has a functionality of 2 or more and reacts with the radicals generated by the photoinitiator
Implementation Method 2
the storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa... suppressing molecular motion in crosslinked products and reducing moisture permeability
Data Source
AI summary
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.