Photosensitive Assembly Molded Portion Glue Overflow Management
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Solution Overview
Problem
Molded camera modules face issues with glue overflow due to flat upper surfaces, leading to size inconsistencies and installation challenges, especially with miniaturization designs requiring precise tilt accuracy and larger mounting planes.
Innovation Solution
A photosensitive assembly with a molded portion featuring a descending groove to accommodate excess glue, maintaining a flat top surface for component alignment and enhancing bonding strength, while the molding process includes a flexible film to form the groove and recessed areas for efficient glue management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flat upper surface is provided on the molded portion for mounting optical assemblies, then the tilt accuracy of mounting lens or motor is improved, but the glue overflows outward making the module size exceed design scope
Solution Approach 1:
The molded portion is designed with different surface characteristics in different regions: the mounting surface maintains a flat upper surface for high tilt accuracy, while the side surfaces are designed as sloping draft edges that can accommodate overflow glue. This local differentiation allows each region to serve its specific function without compromising the other.
Solution Approach 2:
The solution addresses the glue overflow problem by utilizing the vertical dimension through the draft edge design. The sloping side surfaces create a three-dimensional structure that provides space for glue accumulation without affecting the two-dimensional flat mounting surface area, thus containing glue within the module boundaries.
2Area of stationary object
If the flat surface for mounting optical assemblies is enlarged to provide larger mounting plane, then the automatic alignment is facilitated, but the camera module miniaturization is hindered
Solution Approach 1:
The molded portion is designed with different surface characteristics in different regions: the mounting surface maintains a flat upper surface for high tilt accuracy, while the side surfaces are designed as sloping draft edges that can accommodate overflow glue. This local differentiation allows each region to serve its specific function without compromising the other.
Solution Approach 2:
The solution addresses the glue overflow problem by utilizing the vertical dimension through the draft edge design. The sloping side surfaces create a three-dimensional structure that provides space for glue accumulation without affecting the two-dimensional flat mounting surface area, thus containing glue within the module boundaries.
3Strength
If glue is applied in a closed loop for mounting lens or motor, then the bonding strength is improved, but the excess glue has no space to overflow and protrudes outward
Solution Approach 1:
The draft edges that initially seem to be merely structural features for mold removal are repurposed to serve as glue overflow channels. The sloping surfaces naturally guide excess glue away from the mounting area and contain it within the module, converting a potential harmful effect (glue overflow) into a beneficial containment feature.
Solution Approach 2:
The draft edges act as an intermediary structure between the flat mounting surface and the module exterior. They provide a transition zone that receives and contains overflow glue, preventing it from reaching the module's outer boundaries while maintaining the integrity of the closed-loop glue application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable external size, facilitates automatic component alignment, and increases lateral bonding strength by effectively managing glue overflow, ensuring precise mounting and reduced module size variability.
Implementation Method 1
a photosensitive assembly including a photosensitive substrate and a gradient refractive index layer formed on the photosensitive substrate
Implementation Method 2
a gradient refractive index layer formed on the photosensitive substrate
Data Source
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AI summary
Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.