Photosensitive Chip Packaging With Transparent Protective Layer
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Solution Overview
Problem
Conventional semiconductor packaging methods using transparent glass covers for photosensitive chip regions suffer from light refraction, reflection, and energy loss, as well as adhesive detachment issues, which affect the chip's photosensitive performance and expose it to dust.
Innovation Solution
A semiconductor packaging method involving a chip with a photosensitive region, soldering pads, a metal part, and a transparent protective layer that covers the photosensitive region and metal part, with an opening to expose the metal part for electrical connection to a circuit board, using conductive connection parts like wires or conductive folded plates to enhance electrical connectivity and reduce dust exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent glass cover is used to protect the photosensitive region, then the photosensitive region is protected from dust and damage, but light refraction, reflection and energy loss occur reducing photosensitive effect
Solution Approach 1:
The patent changes the material parameter from traditional thick transparent glass to a transparent protective layer with optimized thickness and material composition. This layer is designed to minimize light refraction and reflection while maintaining protective function, directly addressing the energy loss problem while preserving protection reliability.
Solution Approach 2:
The transparent protective layer is applied selectively only where needed for protection, rather than using a full glass cover. The layer's thickness and optical properties are optimized locally to balance protection requirements with light transmission efficiency, reducing overall light energy loss while maintaining reliability.
2Reliability
If a transparent glass cover connected by adhesive is used, then the photosensitive region is protected, but the adhesive may detach after long period use allowing dust to enter
Solution Approach 1:
The patent removes the adhesive layer from the optical path between the transparent protective layer and the photosensitive region. By eliminating the adhesive interface, the design prevents dust accumulation and bonding failure that would otherwise occur at the adhesive interface, maintaining long-term stability and protection reliability.
Solution Approach 2:
The patent introduces a new intermediate structure that eliminates the need for adhesive bonding. The transparent protective layer is directly integrated with the chip structure through a stable mechanical or chemical bond that does not involve organic adhesive, thereby removing the source of detachment and dust accumulation while maintaining protective function.
3Reliability
If a thick transparent glass cover is used, then the photosensitive region is protected, but refraction and reflection occur reducing light transmission
Solution Approach 1:
The patent optimizes the thickness parameter of the transparent protective layer to a much smaller value than traditional glass covers. This thin-layer design minimizes light refraction and reflection effects while maintaining adequate protection, thereby preserving light intensity and photosensitive performance.
Solution Approach 2:
The transparent protective layer is designed with localized optical properties optimized for minimal light interference. The layer's thickness and material composition are specifically tuned in the optical path region to reduce refraction and reflection, maintaining high light intensity while providing necessary protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces light refraction and reflection, improves the photosensitive effect, and minimizes adhesive detachment, providing a more reliable and efficient protection for the chip's photosensitive region.
Implementation Method 1
refraction, reflection, energy loss and the like may occur when light passes through the transparent glass
Implementation Method 2
refraction, reflection, energy loss and the like may occur when light passes through the transparent glass
Implementation Method 3
electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board
Data Source
AI summary
The present disclosure provides a semiconductor packaging method and a semiconductor package device. The method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface; soldering pads; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate. The transparent protective layer covers a photosensitive region of the chip substrate and the metal part, and the transparent protective layer contains an opening at a position corresponding to the metal part to expose a first end of the metal part away from the soldering pads. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part to electrically connect the chip with the circuit board.