Chemically Amplified Photosensitive Composition for Plated Article Templates
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Solution Overview
Problem
Existing chemically amplified positive-type photosensitive compositions struggle to form resist patterns with large undercuts and suppressed footing, which are essential for creating plated articles with excellent collapse margins.
Innovation Solution
A chemically amplified positive-type photosensitive composition comprising an acid generating agent, a resin with increased alkali solubility, a sulfur-containing compound, an acid diffusion suppressing agent, and an organic solvent, specifically designed to form resist patterns with large undercuts and suppressed footing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional chemically amplified positive-type photosensitive composition is used, then the photoresist layer can be formed and patterned, but the plated article collapses under load due to insufficient undercut and footing
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive composition by incorporating specific additives (sulfur-containing compound, acid diffusion suppressing agent, and organic solvent with specific properties) to control acid diffusion behavior during development, thereby achieving the desired undercut shape that prevents plated article collapse
Solution Approach 2:
The patent creates a composite photosensitive composition system combining multiple functional components: acid generating agent, resin, sulfur-containing compound, acid diffusion suppressing agent, and organic solvent, where each component contributes to achieving both the required pattern formation and the undercut shape for collapse resistance
2Reliability
If the resist pattern is made with large undercut to prevent collapse, then collapse resistance improves, but the complexity of controlling the resist pattern shape increases
Solution Approach 1:
The patent enables the resist pattern to self-form the required undercut shape through controlled acid diffusion during development, eliminating the need for complex external processing steps or equipment to achieve the collapse-preventing geometry
Solution Approach 2:
The patent introduces an acid diffusion suppressing agent as an intermediary substance that mediates between the acid generating agent and the resin, controlling the acid diffusion process to naturally produce the desired undercut shape without requiring complex external intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with large undercuts and suppressed footing, thereby reducing the likelihood of collapse in plated articles even under varying loads.
Implementation Method 1
an acid generating agent (A) that generates an acid by irradiation with an active ray or radiation
Implementation Method 2
Heat treatment after exposure promotes diffusion of the generated acid
Data Source
AI summary
A chemically amplified positive-type photosensitive composition for forming a pattern serving as a template in a process of forming a plated article on a substrate having a metal layer on a surface thereof, the chemically amplified positive-type photosensitive composition being capable of easily forming a resist pattern having a cross-sectional shape in which a large undercut is formed and footing is suppressed. The chemically amplified positive-type photosensitive composition includes an acid generating agent that generates an acid by irradiation with an active ray or radiation, a resin having an alkali solubility that increases under action of an acid, a sulfur-containing compound containing a sulfur atom capable of coordinating with the metal layer, an acid diffusion suppressing agent, and an organic solvent, the resin containing an acrylic resin which contains a specific constituent unit, and the decomposition ratio (%) of the acid generating agent determined using specific steps is more than 0.5 and less than 10.