Photosensitive Composition for Semiconductor Lithography
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Solution Overview
Problem
Current photosensitive compositions used in microfabrication for semiconductor elements face challenges in achieving high resolution and low edge roughness, particularly due to the molecular size and structure of polymer compounds, which affect sensitivity and adhesiveness to substrates.
Innovation Solution
A photosensitive composition comprising a low-molecular-weight compound with a specific structure of 7 benzenes connected in 3 directions, combined with a photo-acid generator and a crosslinker, which enhances sensitivity and reduces edge roughness by promoting acid generation and crosslinking reactions upon actinic radiation exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a polymer compound is used as the resist material, then the resist can be developed with an alkali aqueous solution, but the edge roughness increases due to the molecular size of the polymer
Solution Approach 1:
The polymer compound is segmented into multiple low-molecular-weight compounds, each containing a specific number of benzene rings (3-10 rings). This segmentation reduces the molecular size while maintaining the alkali-soluble properties through carboxyl groups, thereby reducing edge roughness while preserving developability.
Solution Approach 2:
The invention changes the molecular weight parameter by using low-molecular-weight compounds instead of high-molecular-weight polymers. By controlling the number of benzene rings (3-10) and incorporating carboxyl groups, the resist maintains alkali solubility while achieving smaller molecular dimensions that reduce edge roughness.
2Manufacturing precision
If the molecular size of the polymer compound is reduced to improve resolution, then the resolution improves, but the adhesiveness to substrate deteriorates
Solution Approach 1:
The invention creates a composite system combining low-molecular-weight compounds with specific benzene ring structures (3-10 rings) and carboxyl groups. This composite structure achieves small molecular size for high resolution while the carboxyl groups provide substrate adhesion, and the benzene rings contribute to both resolution and adhesiveness.
3Manufacturing precision
If a phenol derivative with 10 benzene rings is used to achieve high resolution, then the resolution improves, but the sensitivity deteriorates
Solution Approach 1:
The invention optimizes the number of benzene rings to a specific range (3-10 rings) rather than using 10 rings as in prior art. This parameter optimization, combined with incorporating carboxyl groups, achieves high resolution while improving sensitivity through better acid generation efficiency and solubility characteristics.
Data Source
AI summary
A photosensitive composition is provided, which includes a compound represented by the formula BP; and a photo-acid generator which generates an acid by the action of actinic radiation,wherein R1 is an acid-leaving group, and a part of R1 may be substituted with a hydrogen atom.