Photosensitive Assembly Using Conductive Medium for Stable Chip Bonding

The patent extracts the ACF layer from the circuit board structure and replaces it with separate conductive layers formed directly on the hard board and flexible board. This eliminates the reliance on ACF for electrical connection, providing controllable conduction performance and reducing process temperature requirements.

The patent changes the electrical connection mechanism from ACF-based anisotropic conduction to direct conductive layer contact with controlled impedance. By adjusting the conductive layer thickness, material composition, and geometric parameters, the electrical conduction performance becomes controllable and predictable, while the bonding process occurs at lower temperatures.

The patent removes the ACF layer that requires excessive pressing force for activation and conduction. Instead, the conductive layers are formed as integral parts of the circuit boards with predetermined contact interfaces, eliminating the need for high pressing force during assembly.

The conductive layers are pre-formed on the hard board and flexible board with precise geometric configurations and contact patterns. This preliminary preparation ensures that when the boards are assembled, electrical connection is achieved through the pre-designed contact interfaces without requiring excessive pressing force to activate conduction paths.

The patent merges the photosensitive chip electrical connection with the circuit board conductive layers by forming direct contact interfaces. The conductive layers on both the chip and circuit board are integrated into a unified electrical pathway, eliminating the need for separate wire connections and reducing conduction distance.

The patent introduces a conducting medium layer as an intermediary between the photosensitive chip and circuit board. This conducting medium provides a direct electrical pathway that is shorter and more reliable than wire connections, while also providing mechanical support and alignment functionality.

The patent transitions from a traditional three-dimensional stacked camera module layout to a planar integration approach. By forming conductive layers and electrical connections within the plane of the circuit board rather than requiring vertical stacking and wire connections, the design achieves high pixel and large aperture specifications while maintaining a compact overall volume.

The conductive layers serve multiple functions simultaneously: they provide electrical connection pathways, mechanical support structure, and alignment references for the photosensitive chip. This multi-functionality eliminates the need for separate components and structures, reducing the overall camera module volume while supporting high pixel and large aperture requirements.