Photosensitive element and method for forming resist pattern
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Solution Overview
Problem
Existing photosensitive elements used for forming conductor patterns with high aspect ratios are prone to edge fusion and protective film peeling, especially when forming thick layers, which compromises the integrity and resolution of the resist pattern.
Innovation Solution
A photosensitive element comprising a support, a photosensitive layer with a specific binder polymer to photopolymerizable compound ratio, and a protective film, where the binder polymer contains specific monomer units and the layer has a controlled indentation ratio, enabling suppression of edge fusion and protective film peeling while maintaining high resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the photosensitive layer is made hard to prevent edge fusion, then edge fusion is suppressed, but the protective film is likely to peel without cohering to the photosensitive layer
Solution Approach 1:
The patent applies parameter changes by precisely controlling the content ratio of binder polymer to photopolymerizable compound within 1.10 to 1.80, and controlling the indentation depth ratio to be 45% or less. These parameter optimizations allow the photosensitive layer to achieve sufficient hardness to suppress edge fusion while maintaining adequate adhesion for protective film coherence, thus resolving the technical contradiction between preventing edge fusion and ensuring protective film adhesion.
2Length of moving object
If the photosensitive layer is made thick to form high aspect ratio patterns, then high aspect ratio conductor patterns can be formed, but edge fusion is more likely to occur during storage
Solution Approach 1:
The patent resolves this contradiction by optimizing the composition parameters of the photosensitive resin, specifically controlling the binder polymer to photopolymerizable compound content ratio within 1.10 to 1.80 and the indentation depth ratio to 45% or less. These parameter changes enable thick photosensitive layers to maintain structural stability and resist edge fusion during storage, while still achieving the desired high aspect ratio conductor patterns after development.
3Length of moving object
If the photosensitive layer is made thick to form high resolution patterns, then high aspect ratio structures can be achieved, but manufacturing precision is compromised due to edge fusion
Solution Approach 1:
The patent maintains manufacturing precision in thick photosensitive layers by controlling the binder polymer to photopolymerizable compound content ratio within 1.10 to 1.80 and the indentation depth ratio to 45% or less. These parameter optimizations prevent edge fusion that would otherwise compromise pattern resolution, enabling the formation of high aspect ratio conductor patterns with maintained manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the formation of resist patterns with high aspect ratios, including space portions, coils, and copper pillars with improved adhesion and resolution, reducing edge fusion and protective film peeling issues.
Implementation Method 1
a photosensitive layer formed on the support by using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator
Data Source
AI summary
A photosensitive element, including: a support; a photosensitive layer formed on the support by using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator; and a protective film disposed on a surface of the photosensitive layer on a side opposite to the support, in which a content ratio (content of binder polymer/content of photopolymerizable compound) of the binder polymer to the photopolymerizable compound in the photosensitive resin composition is 1.10 to 1.80, and a ratio of an indentation depth measured when an indenter is squeezed in the photosensitive layer through a PET film by using a microhardness testing machine and retained at a load of 300 mN for 5 seconds to a thickness of the photosensitive layer is 45% or less.