Photosensitive Element Lubricant Control for Resist Defect Reduction

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Solution Overview

Problem

The increase in circuit resolution leads to an increase in resist defects, such as resist chipping, due to lubricant or aggregate particles in the support film of photosensitive elements used in printed wiring board production.

Innovation Solution

A photosensitive element with a support film containing a specific number and size of lubricants, a polyester film structure, and controlled linear expansion coefficients to reduce resist defects, combined with a method for forming a resist pattern and producing a printed wiring board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the resolution of circuit formation is increased, then the quality of printed wiring board is improved, but the number of resist defects increases

Engineering Contradiction:
Improvecircuit resolutionVSAvoidresist defect rate
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent extracts and removes lubricant particles with particle size of 1.0 μm or more from the support film surface, reducing their number to 10 or less per 0.0225 mm2. This extraction of harmful particles resolves the contradiction by eliminating the source of resist defects while maintaining the support film's functional properties.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the parameter of lubricant particle size distribution on the support film surface, specifically controlling the number of particles with 1.0 μm or more to 10 or less per 0.0225 mm2. This parameter change allows high-resolution circuit formation without the resist defects caused by large lubricant particles.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If lubricant particles are present in the support film, then the ease of handling is improved, but the number of resist defects increases

Engineering Contradiction:
Improvehandling easeVSAvoidresist defect rate
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies local quality by differentiating the acceptable presence of small lubricant particles (less than 1.0 μm) while strictly limiting large lubricant particles (1.0 μm or more). This local quality approach maintains the beneficial handling properties from lubricants while eliminating the harmful effect of large particles that cause resist defects.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces resist defects by controlling the number and size of lubricant particles on the support film, enhancing the production of high-resolution printed wiring boards.

Implementation Method 1

the photosensitive layer is exposed through a mask film or the like to form a photo-cured area

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS20250278024A1Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
Publication Date: 2025.09.04 RESONAC CORP
  • US20250278024A1 patent drawing
  • US20250278024A1 patent drawing

AI summary

One aspect of the present disclosure relates to a photosensitive element including a support film containing a lubricant and a photosensitive layer formed on a first surface of the support film, in which a number of lubricants having a particle size of 1.0 μm or more contained in the first surface of the support film is 10 or less per 0.0225 mm2.