Photosensitive Interstitial Layer for PZT Printhead Fabrication

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Solution Overview

Problem

Manufacturing high-density piezoelectric ink jet printheads is complex and costly due to the need for multiple ports through the diaphragm and between piezoelectric elements, requiring intricate processing methods.

Innovation Solution

A method involving a photosensitive interstitial layer between piezoelectric elements, which is attached to the diaphragm using a diaphragm attach material, simplifies the manufacturing process by reducing the number of masks and processing steps, and allows for the use of laser ablation to create openings for ink passage, thereby reducing manufacturing costs and complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple ports are created through the diaphragm and between piezoelectric elements for high-density printhead, then printing resolution is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveprinting resolutionVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the photosensitive interstitial layer between piezoelectric elements before final assembly, and using laser ablation to create ports through the diaphragm and attach material in a single step. This preliminary structuring simplifies subsequent manufacturing steps while maintaining high jet density for improved printing resolution.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces traditional mechanical masking and multi-step etching processes with laser ablation technology. The laser directly removes material to create precise ports through the diaphragm and attach material, eliminating the need for multiple masks and complex mechanical alignment steps, thereby reducing manufacturing complexity while achieving high precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If traditional multi-mask processing is used for creating ports, then port precision is maintained, but manufacturing time and cost increase

Engineering Contradiction:
Improveport precisionVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical multi-mask system with a laser-based direct writing system. The laser ablation process maintains port precision through computer-controlled beam positioning while eliminating the time-consuming steps of applying, aligning, and removing multiple photoresist masks, thereby significantly improving manufacturing efficiency.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and eliminates the photoresist masking steps from the manufacturing process entirely. By using laser ablation to directly create ports through the diaphragm and attach material, the process removes the intermediary masking materials and their associated processing steps, streamlining manufacturing while maintaining precision.

Inventive Principle:
Principle #2Taking out (Extraction)

3Device complexity

If photosensitive interstitial layer is used between piezoelectric elements, then manufacturing process is simplified, but material selection and application complexity increase

Engineering Contradiction:
Improveprocessing stepsVSAvoidmaterial application complexity
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The patent uses a photosensitive interstitial layer that is applied uniformly between all piezoelectric elements in the array. This homogeneous material layer serves multiple functions: it provides electrical isolation, structural support, and a uniform substrate for subsequent laser ablation. The uniformity of the layer simplifies the overall manufacturing process despite the specialized nature of the material.

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The photosensitive interstitial layer serves multiple functions simultaneously: it acts as an electrical insulator between adjacent piezoelectric elements, provides mechanical support during assembly, and serves as a sacrificial layer that defines the port locations through laser ablation. This multi-functionality reduces the need for separate components and simplifies the manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a more efficient and cost-effective production of high-density ink jet printheads with improved printing resolution by eliminating the need for multiple masks and reducing the number of processing steps, while maintaining the integrity of the printhead's functionality.

Implementation Method 1

allows for the use of laser ablation to create openings for ink passage

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

When a voltage is applied to the piezoelectric element, typically through electrical connection with an electrode electrically coupled to a voltage source, the piezoelectric element vibrates

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS8550601B2Use of photoresist material as an interstitial fill for PZT printhead fabrication
Publication Date: 2013.10.08 XEROX CORP
  • US8550601B2 patent drawing
  • US8550601B2 patent drawing
  • US8550601B2 patent drawing

AI summary

An ink jet printhead including a plurality of piezoelectric elements and a photosensitive interstitial layer which fills spaces between each adjacent piezoelectric element. The ink jet printhead can be formed using a simplified method to pattern the photosensitive interstitial layer, and to remove a diaphragm attach material which covers a plurality of openings through a diaphragm using laser ablation.