Photosensitive Detection Layer Layout for Flatness and Fill Factor
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Solution Overview
Problem
The configuration of a film layer in detection devices with switch elements results in uneven surfaces, making it difficult to position photosensitive elements effectively, leading to low fill factors and increased susceptibility to hydrogen ion diffusion, which reduces device reliability.
Innovation Solution
Incorporating a planarization layer between the photosensitive element and the switch element to enhance surface flatness, allowing for increased overlap and higher fill factors, and using a shared conductor layer for the switch element's gate, source, and drain to simplify manufacturing and reduce hydrogen ion diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a film layer is configured in the switch element, then the switch element can be formed, but the surface becomes uneven making it difficult to dispose the photosensitive element above, resulting in a low fill factor
Solution Approach 1:
A planarization layer is introduced as an intermediary between the switch element and the photosensitive element. This planarization layer fills in the surface unevenness caused by the film layer configuration in the switch element, creating a flat surface that allows the photosensitive element to be properly disposed above with high fill factor.
2Ease of manufacture
If a metal layer is configured in the switch element, then the switch element can be formed, but hydrogen ions generated during insulating layer formation can diffuse into the semiconductor, reducing reliability
Solution Approach 1:
The planarization layer serves as a barrier layer that prevents hydrogen ions generated during the chemical vapor deposition process from diffusing into the semiconductor of the switch element. This intermediary layer blocks the harmful hydrogen ion diffusion path while allowing the manufacturing process to proceed normally.
Solution Approach 2:
The planarization layer is formed beforehand to create a protective barrier that cushions against future hydrogen ion diffusion. By establishing this protective layer before the insulating layer formation process, the semiconductor is pre-protected from hydrogen ion contamination.
3Device complexity
If the photosensitive element is disposed above the switch element, then the detection device can be formed, but the uneven surface causes the photosensitive element to have a low fill factor
Solution Approach 1:
The planarization layer acts as a mediator between the switch element and the photosensitive element, providing a flat surface that enables the photosensitive element to achieve high fill factor while maintaining the required device structure.
4Device complexity
If the first semiconductor of the photosensitive element overlaps with the second semiconductor of the switch element, then the detection device can be formed, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The design intentionally creates an asymmetric arrangement where the first semiconductor of the photosensitive element does not overlap with the second semiconductor of the switch element. This asymmetric configuration simplifies the manufacturing process by avoiding the need for precise alignment and complex processing steps required for overlapping semiconductors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the fill factor of the photosensitive element, enhancing its photoelectric conversion efficiency and increases the reliability of the detection device by reducing hydrogen ion diffusion and simplifying the manufacturing process.
Implementation Method 1
a planarization layer is disposed between the bottom electrode and the switch element... using the planarization layer with higher flatness to increase the surface area of the photosensitive element
Implementation Method 2
increasing the fill factor of the photosensitive element, improving its surface area and photoelectric conversion efficiency
Implementation Method 3
The bottom electrode is coupled to the switch element
Data Source
AI summary
A detection device, including a substrate, a switch element, a photosensitive element, and a planarization layer, is provided. The switch element is disposed on the substrate. The photosensitive element includes a bottom electrode, a top electrode, and a first semiconductor disposed between the bottom electrode and the top electrode. The planarization layer is disposed between the bottom electrode and the switch element. The bottom electrode is coupled to the switch element.