Photosensitive Material Reducing Relative Permittivity
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Solution Overview
Problem
Existing photosensitive materials used in display devices with touch panels have high relative permittivity, leading to issues like increased electrical resistance and corrosion, which are not adequately addressed by current technologies.
Innovation Solution
A photosensitive material is developed that includes a polymer with a carboxy group and a compound capable of reducing the carboxy group amount upon exposure, resulting in a film with lower relative permittivity, achieved through specific chemical structures and exposure processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional photosensitive material is used to form a protective film, then the film provides protection against metal corrosion and disconnection, but the film has high relative permittivity which increases electrical resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive material by incorporating specific compounds (compounds B and C) that reduce the relative permittivity of the cured film. The material maintains protective functions while achieving lower permittivity values, directly resolving the contradiction between reliability and electrical resistance.
Solution Approach 2:
The patent creates a composite photosensitive material system combining polymer A (with carboxy groups) and compound B (with structure b0). This composite approach allows the material to simultaneously provide corrosion protection through the polymer matrix and reduce permittivity through the specific chemical interactions of compound B, addressing both requirements.
2Object-affected harmful factors
If a resin pattern is disposed on the conductive pattern to prevent metal corrosion, then corrosion protection is improved, but the electrical resistance between electrodes and drive circuits increases due to high relative permittivity
Solution Approach 1:
The patent modifies the dielectric parameter (relative permittivity) of the protective resin pattern by using a photosensitive material containing compound B. This chemical composition change reduces the permittivity from conventional high values to lower values, thereby decreasing electrical resistance while maintaining the corrosion protection function of the resin pattern.
3Manufacturing precision
If the amount of carboxy group in the polymer is high, then the photosensitive material provides good protective film formation, but the relative permittivity of the formed film becomes too high
Solution Approach 1:
The patent introduces compound B as an intermediary substance that mediates between the carboxy groups of polymer A and the final film properties. Compound B interacts with the carboxy groups during the photosensitive process to reduce the overall permittivity contribution, allowing good film formation to be maintained while permittivity is reduced.
Solution Approach 2:
The patent optimizes the balance between carboxy group content and compound B content to achieve the desired permittivity reduction. By controlling the ratio and concentration of these components, the material maintains sufficient carboxy groups for good film formation while the compound B reduces the net permittivity to acceptable levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the relative permittivity of the formed film, improving electrical properties and preventing corrosion, while also enhancing pattern formability and moisture barrier properties.
Implementation Method 1
a structure b0 in which an amount of the carboxy group included in the polymer A is reduced by exposure
Implementation Method 2
the structure b0 is a structure b capable of accepting an electron from the carboxy group in a photoexcited state
Data Source
AI summary
The present invention provides a photosensitive material with which a film having a low relative permittivity can be formed. In addition, the present invention provides a pattern forming method, a manufacturing method of a circuit wiring, a manufacturing method of a touch panel, and a transfer film, which are related to the photosensitive material.The photosensitive material of the present invention satisfies at least one requirement of the following requirement (V01) or the following requirement (W01).(V01) the photosensitive material includes a polymer A having a carboxy group and a compound β which has a structure b0 in which an amount of the carboxy group included in the polymer A is reduced by exposure.(W01) the photosensitive material includes a polymer Ab0 which is the polymer A and further has the structure b0 in which the amount of the carboxy group included in the polymer A is reduced by exposure.