Photosensitive Module Thermal Management via Vibration
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Solution Overview
Problem
Conventional photosensitive modules in electronic devices face issues with image quality due to shaking, miniaturization challenges, and heat generation by image sensors, which can lead to functional failures or damage.
Innovation Solution
A photosensitive module design incorporating a base assembly with a metal substrate, thermal conductive adhesive, and plastic members to protect and stabilize the image sensor, along with a transparent plate for light transmission, and a vibration assembly to remove dust, enhancing heat dissipation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor is disposed adjacent to the main body of the substrate without protective structures, then the device complexity is reduced, but the reliability deteriorates due to lack of protection against shaking and external forces
Solution Approach 1:
The protective structure is divided into multiple functional components: a first protective component that directly protects the image sensor, and a second protective component that protects electrical connections. This segmentation allows each component to be optimized for its specific protective function while maintaining overall structural simplicity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the image sensor, acts as a platform for disposing protective components, and serves as a base for the entire photosensitive module. This multi-functionality reduces the need for additional separate structural elements.
2Measurement precision
If the image sensor operates at high pixel elements to improve image quality, then the measurement precision is improved, but the temperature rises sharply causing functional failure or damage
Solution Approach 1:
A heat dissipation component is introduced as an intermediary between the image sensor and the external environment. This component facilitates thermal energy transfer from the image sensor to the surrounding air or heat sink, effectively managing the heat generated by high-pixel operations without requiring changes to the image sensor itself.
3Volume of moving object
If the photosensitive module is miniaturized to reduce device size, then the weight and volume are reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation solution extends in the vertical dimension with a protruding heat dissipation component that projects from the photosensitive module. This dimensional extension provides increased surface area for heat dissipation without significantly increasing the horizontal footprint of the module, thereby maintaining miniaturization while improving thermal management.
4Reliability
If the transparent plate is added to protect the image sensor and enable dust removal, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The transparent plate is configured to be movable through vibration, enabling dust removal functionality. By integrating this vibrational mechanism into the existing protective structure, the patent achieves dust removal capability without adding a completely separate mechanical system, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency, mechanical stability, and image quality by reducing skew and protecting electrical connections, while enabling miniaturization and effective dust removal.
Implementation Method 1
thermal conductive adhesive disposed between the substrate and the image sensor
Implementation Method 2
When the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor
Data Source
AI summary
A photosensitive module is provided, which can be disposed in an electronic device for receiving light passing through a lens in the electronic device, including a base assembly, an image sensor, a first plastic member and a transparent plate. The base assembly includes a substrate, and the substrate has a main body including a metal material. The image sensor is disposed on the base assembly and adjacent to the main body of the substrate. The first plastic member is connected to the base assembly and configured to protect the image sensor. The transparent plate is located on the first plastic member. When the photosensitive module receives the light passing through the lens, the light passes through the transparent plate to the image sensor.