Photosensitive Element Layout With Light-Shield Opening Contact
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Solution Overview
Problem
The manufacturing process of optical sensing devices is complex and costly due to the need for multiple photomasks and steps, which hinders the simplification and cost reduction of the process.
Innovation Solution
A sensing device and method that integrate partial structures of the photosensitive element and optical element, reducing the number of masks and steps by using a substrate with a circuit layer, photosensitive element, light-shielding layer, and conductive layer, where the conductive layer passes through an opening in the light-shielding layer to be electrically connected to the photosensitive element, thereby simplifying the manufacturing process and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple photomasks and manufacturing steps are used to create separate photosensitive element and optical element structures, then the device performance can be improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the photosensitive element and optical element into a single integrated structure formed through one photomask pattern. The photosensitive layer and optical cavity are created simultaneously in the same patterning step, eliminating the need for separate photomasks and reducing manufacturing complexity while maintaining device performance.
Solution Approach 2:
The single photomask pattern serves multiple functions: it defines both the photosensitive element geometry and the optical cavity structure. This universal patterning approach replaces multiple specialized photomasks, simplifying the manufacturing process while achieving the same functional results.
2Reliability
If multiple photomasks and manufacturing steps are used to create separate photosensitive element and optical element structures, then the device performance can be improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines the photosensitive element and optical element into a single integrated structure formed through one photomask pattern. The photosensitive layer and optical cavity are created simultaneously in the same patterning step, eliminating the need for separate photomasks and reducing manufacturing complexity while maintaining device performance.
Solution Approach 2:
The single photomask pattern serves multiple functions: it defines both the photosensitive element geometry and the optical cavity structure. This universal patterning approach replaces multiple specialized photomasks, simplifying the manufacturing process while achieving the same functional results.
3Reliability
If the conductive layer is extended to pass through the light-shielding layer opening, then the electrical connection to the photosensitive element is improved, but the capacitance and leakage current increase
Solution Approach 1:
The conductive layer is selectively extended only in the local region where the light-shielding layer has an opening, rather than being uniformly extended across the entire device. This localized extension provides necessary electrical connection while minimizing the total conductive material area that would contribute to capacitance and leakage current.
Solution Approach 2:
The conductive layer extension is applied partially - only where absolutely necessary for electrical connection through the light-shielding opening - rather than excessively extending it across the entire photosensitive element area. This partial action achieves the connection goal while minimizing parasitic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the equivalent capacitance of the photosensitive element, enhances sensitivity, and improves overall device performance by minimizing leakage current and capacitance, while also reducing manufacturing complexity and costs.
Implementation Method 1
The photosensitive element in the optical sensing device can convert received light into an electrical signal
Data Source
AI summary
A sensing device is provided. The sensing device includes a substrate, a circuit layer, a photosensitive element, a light-shielding layer, and a conductive layer. The circuit layer is disposed on the substrate. The photosensitive element is disposed on the substrate and is electrically connected to the circuit layer. The light-shielding layer is disposed on the photosensitive element and has an opening. The opening overlaps the photosensitive element. The conductive layer is disposed on the light-shielding layer. In addition, the conductive layer passes through the opening and is electrically connected to the photosensitive element. A method of manufacturing a sensing device is also provided.


