Photosensitive Paste Antenna Substrate Photolithography Patterning

The patent replaces the mechanical punching blade method with a photolithography-based printing method. Instead of using mechanical force to cut metal foil, the invention uses photosensitive paste applied through a mesh screen, followed by light exposure and development to form precise antenna patterns. This substitution enables fine patterning while maintaining cost-effectiveness through a simpler process that eliminates complex mechanical tooling.

The patent employs a disposable mesh screen for printing the photosensitive paste, replacing the expensive and complex etching machinery. The mesh screen can be easily replaced or reused multiple times, significantly reducing equipment costs. The printing process uses simple, inexpensive materials like photosensitive paste and standard photolithography chemicals, eliminating the need for costly etching chemicals and equipment while achieving comparable or superior pattern precision.

The patent optimizes multiple parameters of the printing process to achieve fine patterning. This includes adjusting the mesh screen specifications (opening size, wire diameter), controlling the photosensitive paste viscosity and composition, optimizing exposure light intensity and wavelength, and refining development conditions. By carefully tuning these parameters, the invention achieves precise antenna patterns with fine features while maintaining the cost advantages of the printing method.

The patent transitions from conventional thick-film printing to a thin-film photolithography approach. By applying photosensitive paste in a controlled manner through a mesh screen and using optical exposure, the process achieves much finer line widths in the horizontal dimension. The photolithography technique enables precise control of feature sizes down to tens of micrometers, allowing high integration of wiring lines and electrodes while keeping the process simple and cost-effective.