Photosensitive Insulating Paste for High-Resolution Light Shielding

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Solution Overview

Problem

Existing photosensitive pastes used in electronic components fail to achieve high resolution before firing while suppressing light transmittance and crack formation after firing, leading to visibility issues with internal electrode layers and reduced design flexibility.

Innovation Solution

A photosensitive insulating paste containing glass frit, a first inorganic filler with a refractive index of 1.7 or higher, a second inorganic filler with a refractive index of 1.55 or lower, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent, which adjusts light transmittance and mechanical strength by controlling the filler ratios and firing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a light-shielding inorganic filler is added to the photosensitive paste to suppress light transmittance after firing, then light transmittance is suppressed, but light transmittance is degraded during photolithographic patterning and high resolution cannot be achieved

Engineering Contradiction:

Improvelight transmittance suppressionVSAvoidresolution

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent changes the refractive index parameter of the inorganic filler from conventional values (typically 1.5-1.6) to a higher value of 1.7 or more. This parameter change enables the filler to suppress light transmittance effectively after firing while maintaining compatibility with photolithographic patterning processes, thereby achieving both light transmittance suppression and high resolution simultaneously

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite material system consisting of glass frit combined with inorganic filler having a refractive index of 1.7 or more. This composite formulation achieves synergistic effects where the glass frit provides base matrix properties and the high refractive index filler provides light shielding, enabling both high resolution before firing and light transmittance suppression after firing

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If the thickness of the side gap portion is increased to prevent the internal electrode layer from being visible through the electronic component surface, then light transmittance is suppressed, but design flexibility is degraded and miniaturization cannot be achieved

Engineering Contradiction:

Improvevisibility of internal electrodeVSAvoiddesign flexibility

Core Design Contradiction:

Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The patent changes the refractive index parameter of the inorganic filler to 1.7 or more, which enhances the light shielding capability per unit thickness. This allows the side gap portion to maintain thin dimensions (achieving miniaturization and design flexibility) while still effectively preventing the internal electrode layer from being visible through the electronic component surface

Inventive Principle:

Principle #35Parameter changes

3Illumination intensity

If the photosensitive paste does not contain inorganic filler to maintain high light transmittance, then light transmittance is maintained, but crack extension cannot be suppressed

Engineering Contradiction:

Improvelight transmittanceVSAvoidcrack resistance

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The patent changes the refractive index parameter of the inorganic filler to 1.7 or more, which optimizes the balance between light transmittance and mechanical properties. This specific refractive index range enables the inorganic filler to provide crack resistance while maintaining adequate light transmittance, resolving the contradiction between these two requirements

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system where glass frit and inorganic filler (with refractive index 1.7 or more) work together. The glass frit matrix provides toughness and crack resistance, while the inorganic filler enhances mechanical strength and maintains light transmittance, achieving both reliability and optical performance simultaneously

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides high resolution before firing and suppresses light transmittance and crack formation after firing, maintaining mechanical strength and design flexibility in electronic components.

Implementation Method 1

a photopolymerization initiator, and a solvent

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS11886114B2Photosensitive insulating paste and electronic component

Publication Date: 2024.01.30 MURATA MFG CO LTD

AI summary

A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.