Photosensitive Conductive Paste for Firing Shrinkage Matching
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Solution Overview
Problem
Existing photosensitive conductive pastes used in laminated electronic components face issues with delamination due to mismatched shrinkage behaviors between the internal electrode and the element body material during firing, despite reducing firing shrinkage, and require larger conductive powder sizes for improved resolution.
Innovation Solution
A photosensitive conductive paste containing a conductive powder, an organic component with an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and an organic flame retardant, which controls shrinkage behavior by matching it with the element body material's shrinkage, using a cellulose derivative as the alkali-soluble polymer to further reduce decomposition rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If firing shrinkage of the internal electrode is reduced by using common materials or larger conductive powder, then shrinkage mismatch with element body material is improved, but delamination occurs due to non-equivalent shrinkage behavior
Solution Approach 1:
The patent modifies the organic component composition parameters, specifically incorporating an organic flame retardant and controlling the ratio of conductive powder particle sizes. These parameter changes adjust the shrinkage behavior of the photosensitive conductive paste to match the element body material during firing, preventing delamination while maintaining low electrical resistance
Solution Approach 2:
The patent uses a composite approach by combining conductive powder particles of different average particle diameters (first conductive powder with 5 μm or less and second conductive powder with 0.2 to 2.0 μm) in specific weight ratios. This composite structure allows the paste to achieve both reduced firing shrinkage and shrinkage behavior equivalence with the element body material
2Manufacturing precision
If common materials are used to reduce firing shrinkage, then shrinkage control is improved, but resolution in photolithographic patterning deteriorates
Solution Approach 1:
The patent changes the formulation parameters by replacing common materials with a specifically designed organic component system containing an organic flame retardant. This allows shrinkage control to be achieved through chemical composition adjustment rather than relying on common materials that would compromise photolithographic resolution
Solution Approach 2:
The patent applies different particle size conductive powders in specific proportions (first conductive powder: 5 μm or less, second conductive powder: 0.2 to 2.0 μm in weight ratio of 20/80≤ratio≤80/20). The finer second conductive powder maintains photolithographic resolution while the combination provides adequate shrinkage control
3Manufacturing precision
If larger conductive powder sizes are used to reduce firing shrinkage, then shrinkage control is improved, but electrical resistance increases
Solution Approach 1:
The patent creates a composite conductive powder system combining particles of two different average particle diameters. The finer second conductive powder (0.2 to 2.0 μm) ensures low electrical resistance by providing better packing and conductivity pathways, while the combination with first conductive powder (5 μm or less) in controlled weight ratios achieves the necessary shrinkage control during firing
4Reliability
If firing shrinkage is reduced to match element body material, then delamination is suppressed, but shrinkage behavior equivalence is difficult to achieve
Solution Approach 1:
The patent adjusts multiple parameters simultaneously: the organic component composition (including organic flame retardant), the ratio of conductive powder particles with different average particle diameters, and the amounts of each component. These coordinated parameter changes enable the shrinkage behavior to match the element body material during firing, achieving both delamination suppression and shrinkage equivalence
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled shrinkage behavior suppresses delamination, maintains low electrical resistance, and improves resolution in photolithographic patterning without the need for larger conductive powder sizes.
Implementation Method 1
The organic component includes an alkali-soluble polymer, a photosensitive monomer, and a photopolymerization initiator
Implementation Method 2
the photosensitive conductive paste contains a cellulose derivative as the alkali-soluble polymer... successfully has a reduced electric resistance
Data Source
AI summary
A photosensitive conductive paste, a method for producing a laminated electronic component, and a laminated electronic component controlled in shrinkage behavior during firing are provided. A photosensitive conductive paste contains a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a solvent, and an organic flame retardant. Another photosensitive conductive paste contains a conductive powder, an organic component, and a solvent, and contains a cellulose derivative as the alkali-soluble polymer.