Photosensitive Polybenzoxazole Film Composition for Low-Temperature Curing
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Solution Overview
Problem
Conventional polyimide and polybenzoxazole resins used in semiconductor devices face challenges such as high temperature degradation, complex processing steps, high costs due to organic solvents, and insufficient photosensitivity, which hinder the development of films with optimal thermal and electrical properties.
Innovation Solution
A compound with unsaturated double bonds, specifically designed with a combination of diamine-derived and dicarboxylic acid-derived moieties, allows for the formation of a polybenzoxazole film that can be cured at low temperatures (225°C or lower) using a dilute alkali solution, enhancing developability and resolution while maintaining thermal and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyimide or polybenzoxazole resin is used as surface protective film or interlayer insulating film, then heat resistance and mechanical properties are improved, but complicated processing steps including photoresist application and peeling are required
Solution Approach 1:
The patent combines the heat-resistant resin material with photosensitive properties into a single integrated material. The polyimide or polybenzoxazole resin is modified to include photoresponsive groups, allowing it to function both as a heat-resistant structural material and as a photoresist, thereby eliminating separate photoresist application and peeling steps from the processing sequence.
Solution Approach 2:
The heat-resistant resin material is designed to perform multiple functions simultaneously: it provides thermal stability for high-temperature processing, serves as the interlayer insulating or surface protective film material, and acts as a photoresist for pattern formation. This multi-functionality reduces the number of different materials and processing steps required.
2Reliability
If polyimide or polybenzoxazole resin is fired at high temperature of about 350°C, then excellent heat resistance and mechanical properties are obtained, but next-generation memories and sealing resins get degraded
Solution Approach 1:
The patent modifies the chemical composition and crosslinking structure of the polyimide or polybenzoxazole resin to achieve adequate heat resistance at lower curing temperatures. By adjusting molecular weight, introducing specific crosslinking agents, or modifying the polymer backbone structure, the material can be cured at temperatures that protect temperature-sensitive components while still achieving the required thermal stability.
Solution Approach 2:
The resin is pre-modified during synthesis to include pre-formed crosslinking structures or thermally stable moieties that enable lower curing temperatures. This preliminary structural preparation allows the material to achieve its final heat-resistant properties without requiring exposure to temperatures that would damage sensitive semiconductor components.
3Strength
If conventional polyimide resin is used, then good mechanical properties are obtained, but large amount of organic solvent is required in development step increasing cost and environmental impact
Solution Approach 1:
The patent changes the solubility parameters of the polyimide resin by modifying its chemical structure, such as introducing polar groups, adjusting molecular weight distribution, or adding hydrophilic segments. These modifications enable the resin to be dissolved or dispersed in water or dilute aqueous solutions instead of requiring large amounts of organic solvents, while maintaining the mechanical properties through controlled crosslinking or crystallization.
Solution Approach 2:
The patent replaces expensive and environmentally problematic organic solvents with water or simple aqueous solutions that are inexpensive, non-flammable, and environmentally benign. This substitution reduces both the cost of materials and the environmental impact of the development process while achieving comparable or superior processing performance.
4Ease of operation
If positive photosensitive composition based on polyamide acid is used, then good developability is achieved, but large amount of free carboxylic acid causes backbone hydrolysis and extremely low storage stability
Solution Approach 1:
The patent removes or neutralizes the free carboxylic acid groups from the polyamide acid backbone that cause hydrolysis and instability. This can be achieved by converting carboxylic acids to stable esters, amides, or by incorporating them into the polymer backbone structure where they no longer exist as free acidic groups. The developability is maintained through alternative mechanisms such as base-sensitive imide ring opening or other photoresponsive group incorporation.
Solution Approach 2:
The patent introduces intermediary protective groups or stabilizing molecules that prevent direct contact between free carboxylic acid groups and water during storage. These intermediaries may be molecular additives that complex with carboxylic acids, or structural modifications that shield acidic groups from hydrolytic attack, thereby extending storage stability without compromising developability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound enables the production of films with excellent thermal and electrical properties, including low dielectric constants and dissipation factors, facilitating miniaturization and high functionality in semiconductor devices without the need for high-temperature processing or excessive organic solvents.
Implementation Method 1
a method of mixing polyamide acid with a compound having an amino group, an amide group, a urethane group, or the like, and heating the mixture after an exposure in the presence of a photoinitiator
Implementation Method 2
A thin film of a polyimide resin or a polybenzoxazole resin that is excellent in heat resistance and mechanical properties can be generally obtained by thermal dehydration ring closure of a coating film of a precursor thereof, which requires a firing at a high temperature of about 350° C.
Implementation Method 3
there have been proposed methods of using various heat-resistant resin materials capable of developing images (being patterned) with a dilute aqueous alkali solution
Data Source
AI summary
A compound having unsaturated double bonds of formula (1):wherein A1 represents a divalent linking group of formula (1-1), (1-2), or (1-3):wherein ring a represents a benzene cyclohexane ring; X represents a direct bond or a divalent linking group; Z represents a monovalent substituent; p, q, and r are numbers of the monovalent substituent Z, p and q each independently represent an integer of 0 to 3, r represents an integer of 0 to 2,or a divalent linking group other than formulae (1-1), (1-2), and (1-3), provided that at least one of A1 is a divalent linking group of formula (1-1), (1-2), or (1-3); A2 represents a divalent linking group; A3 represents a hydrogen atom or a methyl group; and n is an average value of the repeating unit numbers, and is a real number within a range of 1≤n≤9).