Negative Photosensitive Polyimide Polymer for Semiconductor Applications
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Solution Overview
Problem
Current negative photosensitive polyimides require development with organic solvents, leading to environmental pollution and high costs, and have limitations in thermal stability and adhesion in semiconductor applications.
Innovation Solution
A novel negative photosensitive polyimide polymer with a specific repeating unit and photosensitive group, developable in an aqueous alkaline solution, providing improved thermal stability, high resolution, and adhesion, and reduced volume shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional negative photosensitive polyimides are developed with organic solvents, then development is achieved, but environmental pollution increases and costs rise
Solution Approach 1:
The patent changes the chemical composition parameter of the developer from organic solvents to aqueous alkaline solution. The polyimide contains basic groups (such as amine groups) that react with the aqueous alkaline developer, enabling selective dissolution of unexposed areas without requiring harmful organic solvents, thus resolving the contradiction between manufacturability and environmental harm
Solution Approach 2:
The patent employs a disposable aqueous alkaline developer solution that can be easily prepared and discarded after use. This replaces expensive and environmentally harmful organic solvent systems with a simple, inexpensive, and eco-friendly alternative, addressing both cost and pollution concerns
2Ease of manufacture
If conventional negative photosensitive polyimides are developed with organic solvents, then development is achieved, but costs increase
Solution Approach 1:
The patent changes the developer composition from expensive organic solvents to inexpensive aqueous alkaline solutions. Common bases like NaOH, KOH, or ammonia can be used at low concentrations, dramatically reducing material costs while maintaining effective development, thus resolving the contradiction between manufacturability and cost
3Reliability
If photosensitive groups are incorporated into polyimide structure, then photosensitivity is achieved, but thermal stability may be affected
Solution Approach 1:
The patent introduces photosensitive groups at specific local positions within the polyimide chain rather than throughout the entire structure. By strategically placing photosensitive moieties (such as vinyl groups or carbonyl groups) at ortho positions relative to amine groups, the patent achieves necessary photosensitivity while preserving the overall thermal stability of the polyimide backbone
Solution Approach 2:
The patent creates a composite polyimide structure combining thermally stable polyimide backbone with photosensitive functional groups. This composite approach allows the material to exhibit both thermal stability from the polyimide matrix and photosensitivity from the incorporated functional groups, resolving the contradiction between these two properties
4Manufacturing precision
If conventional photosensitive polyimides are used, then pattern formation is achieved, but adhesion in semiconductor applications is limited
Solution Approach 1:
The patent introduces polar functional groups (such as carboxyl, hydroxyl, or amine groups) at specific locations within the polyimide chain to enhance adhesion. These localized polar groups provide improved bonding to semiconductor substrates and underlying layers, while the overall pattern formation capability is maintained through the photosensitive groups, thus resolving the contradiction between pattern resolution and adhesion strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer achieves high-resolution patterns and improved adhesion in semiconductor applications, reducing environmental impact by using an aqueous alkaline solution for development, and offering enhanced performance over traditional systems.
Implementation Method 1
a photosensitive group is present the main structure of the polyimides so as to impart the polyimides with photosensitivity, which allows the polyimides to have the properties associated with an insulating layer and photoresist
Implementation Method 2
The polymer has an acid radical, and is developable in an aqueous alkaline solution
Data Source
AI summary
The present invention relates to a negative photosensitive polyimide polymer having a repeating unit of formula (1) as a polymerized unit:wherein G, Q and P* are as defined in the specification. The polyimide polymer of the present invention is developable in an aqueous alkaline solution, and has the properties associated with an insulating layer and photoresist.