Negative Photosensitive Polyimide Resin for Focus-Shift Resolution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional negative photosensitive resin compositions face challenges in achieving satisfactory resolution and adhesion to mold resins, especially when focus depth shifts occur, and they struggle with void generation at the interface of the Cu layer and resin layer after high temperature storage tests.
Innovation Solution
A negative photosensitive resin composition is developed, comprising a polyimide precursor with an unsaturated double bond in the side chain and a photopolymerization initiator with an oxime structure, which improves resolution, adhesion, and suppresses void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional negative photosensitive resin composition is used, then manufacturing process is simple, but resolution deteriorates when focus depth shifts occur
Solution Approach 1:
The patent modifies the chemical parameters of the resin composition by incorporating specific components: a polyimide precursor with unsaturated bonds, a silane coupling agent, and a photopolymerization initiator. These parameter changes enable the composition to maintain high resolution even when focus depth shifts occur, while preserving the simplicity of the manufacturing process.
2Strength
If conventional negative photosensitive resin composition is used, then adhesion to mold resin is insufficient, but improving adhesion increases composition complexity
Solution Approach 1:
The silane coupling agent serves as an intermediary substance between the polyimide precursor and the mold resin. This mediator enhances the adhesion strength by creating strong chemical bonds at the interface, resolving the contradiction between achieving sufficient adhesion and maintaining composition simplicity.
3Reliability
If conventional negative photosensitive resin composition is used, then voids form at Cu layer-resin layer interface after high temperature storage, but preventing voids increases composition complexity
Solution Approach 1:
The silane coupling agent performs preliminary anti-action by pre-treating the surface and forming a strong bonding layer before the Cu layer is deposited. This preliminary action prevents void formation at the interface during subsequent high temperature storage, eliminating the need for additional anti-voiding measures.
4Reliability
If polyimide precursor with unsaturated bond and silane coupling agent are used, then chemical resistance and resolution are improved, but manufacturing cost increases
Solution Approach 1:
The patent optimizes the concentrations and molecular structures of the polyimide precursor and silane coupling agent to achieve the desired chemical resistance and resolution. By carefully controlling these parameters, the manufacturing cost is kept reasonable while attaining the required performance levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high chemical resistance and resolution, while effectively preventing void formation at the Cu layer-resin layer interface, even under high temperature storage conditions.
Implementation Method 1
a photopolymerization initiator having an oxime structure
Implementation Method 2
polyimide precursor having an unsaturated double bond in the side chain
Data Source
AI summary
Provided are a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.