Photosensitive Polyimide Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
Conventional photosensitive polyimide resins require high temperatures and long baking times, leading to oxidation issues and poor solvent resistance, and existing low-temperature alternatives have inadequate flame retardancy and high alkaline developer requirements.
Innovation Solution
A photosensitive polyimide resin composition incorporating an infrared absorber, epoxy compound, and photo initiator, which allows for lower temperature curing through infrared irradiation, improving chemical resistance and film-forming capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive polyimide is cured at high temperature (350°C), then complete crosslinking and polyimide formation are achieved, but oxidation problems occur and processing time increases
Solution Approach 1:
The patent introduces an infrared absorber that changes the curing mechanism from thermal conduction to infrared photothermal conversion, enabling effective curing at lower temperatures (200-300°C) while maintaining complete crosslinking. The infrared absorber absorbs infrared radiation and converts it to heat locally, raising the curing temperature parameter without requiring the overall system temperature to reach 350°C
Solution Approach 2:
The patent replaces conventional thermal conduction heating with infrared radiation heating. The infrared absorber converts infrared radiation into thermal energy directly at the curing site, substituting the mechanical/thermal conduction process with an optical-to-thermal energy conversion process, thereby achieving efficient curing at lower temperatures
2Temperature
If soluble photosensitive polyimide with high acrylate content is used for low temperature curing (230°C), then curing temperature is reduced, but flame retardant property deteriorates
Solution Approach 1:
The patent creates a composite resin system combining photosensitive polyimide with infrared absorber and epoxy compound. This composite formulation enables low-temperature curing while the polyimide matrix provides inherent flame retardancy, eliminating the need for phosphorus or halogen additives that would compromise environmental compatibility
3Temperature
If soluble photosensitive polyimide is cured at low temperature (230°C), then processing temperature is reduced, but solvent resistance becomes poor
Solution Approach 1:
The patent formulates a composite system where photosensitive polyimide provides the base matrix and epoxy compound adds crosslinking functionality. The combination enables sufficient crosslinking density at lower temperatures (200-300°C) to achieve good solvent resistance, overcoming the limitation of soluble PSPI materials that require high curing temperatures for adequate crosslinking
Solution Approach 2:
The patent changes the crosslinking mechanism by incorporating epoxy compound that reacts with the photosensitive polyimide. This chemical modification allows achieving adequate crosslinking density at lower temperatures, thereby improving solvent resistance without requiring high curing temperatures
4Adaptability or versatility
If ionic bonding of acrylic acid ester monomer with COOH group is used, then negative type PSPI material is formed, but high temperature and long baking are still required
Solution Approach 1:
The patent replaces conventional thermal conduction heating with infrared radiation heating for the ionic bonding process. The infrared absorber converts infrared radiation into heat, enabling rapid heating and reducing the baking time required for the acrylic acid ester monomer to bond with the COOH group, thus maintaining material functionality while significantly reducing processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient crosslinking and pattern formation at lower temperatures, reducing processing time and avoiding oxidation issues while maintaining excellent solvent resistance and environmental sustainability.
Implementation Method 1
an infrared absorber having the maximum absorption and the minimum absorption in a specific wavelength range... The infrared absorber is a dye or a pigment, has a maximum absorption wavelength of 500-4000 nm in a solvent and a heat conversion rate of greater than 70%
Implementation Method 2
The resin composition comprises (a) an infrared absorber, (b) an epoxy compound, (c) a photosensitive polyimide, and (d) a photo initiator
Data Source
AI summary
A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1):wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.