Photosensitive Polyimide Resin for Low-Dk 5G Semiconductor Layers
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Solution Overview
Problem
Existing polyimide materials used in 4G LTE communication do not meet the requirements of low dielectric constant (Dk) and low dielectric loss factor (Df) necessary for 5G communication, and modifying production lines to use liquid crystal polymer (LCP) is costly, necessitating the development of polyimide precursor resins with improved electrical and mechanical properties.
Innovation Solution
A photosensitive resin composition comprising a polyimide resin with specific structural modifications, including substituents R1 and R2, linking groups X1 and Y1, and terminal functional groups, along with photopolymerizable compounds, photopolymerization initiators, and solvents, to achieve low Dk and Df, enhanced elongation, and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional polyimide materials are used, then existing production lines can be maintained, but the dielectric constant and dielectric loss factor are too high for 5G communication requirements
Solution Approach 1:
The patent modifies the chemical structure of polyimide precursor resins by changing parameters such as introducing specific aromatic rings, adjusting molecular weight, and incorporating low-dielectric-constant groups. These parameter changes enable the resin to achieve low Dk and Df values suitable for 5G while maintaining compatibility with existing polyimide production processes
Solution Approach 2:
The patent creates composite polyimide precursor resin systems by combining multiple resin components with different functional characteristics. This composite approach allows optimization of dielectric properties while maintaining processability and adhesion, resolving the contradiction between manufacturing ease and transmission performance
2Reliability
If liquid crystal polymer is used to achieve low dielectric constant and loss factor, then signal transmission performance improves, but production line modification costs increase significantly
Solution Approach 1:
The patent creates a polyimide-based material that copies or mimics the low dielectric properties of LCP without requiring a complete material system change. By designing polyimide precursor resins with specific molecular structures that achieve comparable Dk and Df values, the patent allows manufacturers to maintain existing polyimide production lines while obtaining LCP-like electrical performance
3Reliability
If polyimide resin structure is modified to reduce dielectric constant and loss factor, then electrical properties improve, but mechanical properties such as elongation may deteriorate
Solution Approach 1:
The patent applies local quality by introducing specific functional groups and molecular structures at particular positions within the polyimide precursor resin molecules. By strategically placing low-dielectric-constant groups in certain regions while maintaining overall molecular integrity, the patent achieves low Dk and Df without compromising the mechanical strength and elongation properties of the cured film
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition reduces dielectric constant and loss factor while improving mechanical properties, making it suitable for high-speed signal transmission in semiconductor devices.
Implementation Method 1
a photopolymerizable compound; a photopolymerization initiator
Data Source
AI summary
A photosensitive resin composition including a polyimide resin represented by Chemical Formula 1; a photopolymerizable compound; a photopolymerization initiator; and a solvent, a photosensitive resin layer manufactured utilizing the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are disclosed.