Photosensitive Polyimide for Low-Stress Semiconductor Packaging
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Solution Overview
Problem
Conventional photosensitive polyimides require high temperatures for imidization, leading to internal stress and potential damage such as cracks or deformation in electronic products, which is undesirable for three-dimensional stack package structures with increased integration density and low power consumption demands.
Innovation Solution
A novel polymer with a phenylbenzoxazole moiety and terminal hydroxyl or carboxyl groups is developed, allowing for low-temperature curing (≤230°C) and reduced stress, achieved through a polymerization method using specific anhydrides, diamines, and end-capped agents, resulting in a photosensitive resin composition with improved developability and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive polyimide is used for high thermal stability and mechanical properties, then the material achieves excellent thermal stability and mechanical/electrical/chemical properties, but high curing temperature (350°C) causes internal stress leading to cracks, delamination, or deformation in electronic products
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide by introducing phenylbenzoxazole moieties and specific diamine/anhydride combinations, which fundamentally alters the curing behavior to enable low-temperature crosslinking while maintaining thermal stability. This structural modification allows the material to achieve high reliability without the harmful high-temperature curing process
Solution Approach 2:
The patent creates a composite photosensitive resin system combining the newly synthesized polyimide with phenolic hardeners and other additives. This composite formulation enables low-temperature curing chemistry that produces crosslinked networks with high thermal stability, thereby achieving both reliability and avoiding internal stress damage
2Reliability
If high temperature curing is applied to achieve excellent material properties, then thermal stability is improved, but manufacturing complexity increases due to damage control requirements
Solution Approach 1:
By changing the chemical composition parameters to include phenylbenzoxazole-containing polyimide with specific functional groups, the patent enables curing at temperatures ≤230°C. This parameter change simplifies the manufacturing process by eliminating the need for complex high-temperature process control and damage prevention measures
3Strength
If conventional photosensitive polyimide is used for encapsulation applications, then good mechanical properties are achieved, but the material causes deformation of the carrier due to internal stress
Solution Approach 1:
The patent modifies the polyimide structure by incorporating phenylbenzoxazole moieties and terminal hydroxyl/carboxyl groups that enable low-temperature crosslinking. This structural parameter change allows the material to develop mechanical strength without generating internal stress that would deform the carrier, thus resolving the contradiction between strength and shape stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer enables high developability, resolution, and chemical resistance of the cured product, suitable for semiconductor applications with reduced risk of damage from internal stress, while maintaining excellent electrical properties.
Implementation Method 1
A composition is subjected to a polymerization, obtaining the polymer
Implementation Method 2
the photosensitive resin composition includes components (A)-(C) uniformly distributed in a solvent... the component (B) is a compound having a phenyl group; and, the component (C) is a photosensitive agent
Data Source
AI summary
A polymer, a method for preparing the same, and a photosensitive resin composition thereof are provided. The polymer has a structure represented by Formula (I):wherein R1 is —OH, or —COOH; A1 iseach A2 is independentlyeach A3 is independentlyZ is —O—, —S—, —C(CH3)2-, —C(CF3)2-,m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and, the repeat unitsare arranged in a random fashion.