Photosensitive Polyimide Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
Existing photosensitive resin compositions used in semiconductor devices require high temperatures for curing, leading to insufficient developability and high dielectric constant properties, which are unsuitable for high-frequency electrical signals.
Innovation Solution
A curable photosensitive resin composition containing a polyimide resin derived from aromatic tetracarboxylic anhydride and dimer diamine, maleimides, and a polyfunctional polymerizable compound, allowing for low-temperature curing and improved developability while maintaining low dielectric constant properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If photosensitive resin composition containing polyimide precursor or polybenzoxazole precursor is used, then heat resistance and mechanical properties are improved, but curing temperature must be at least 230°C and dielectric constant increases
Solution Approach 1:
The patent changes the chemical structure parameters of the resin composition by using polyimide resin with specific molecular weight range (5,000-50,000) and incorporating maleimide compounds with particular structures. These parameter changes enable the resin to cure at lower temperatures (150-200°C) while maintaining heat resistance, resolving the contradiction between heat resistance and curing temperature
Solution Approach 2:
The patent creates a composite photosensitive resin composition by combining polyimide resin with maleimide compounds and polymerizable compounds. This composite material approach allows the system to achieve both low-temperature curability and high heat resistance, as the maleimide compounds facilitate lower temperature curing while the polyimide resin provides the heat resistance backbone
2Reliability
If photosensitive resin composition containing polyimide precursor is used, then adhesion and developability are improved, but dielectric constant and dielectric dissipation factor increase
Solution Approach 1:
The patent changes the molecular structure parameters by selecting polyimide resin with specific molecular weight (5,000-50,000) and incorporating maleimide compounds with specific structures. These parameter changes reduce the polarity of the cured film, thereby lowering the dielectric constant and dielectric dissipation factor while maintaining adhesion properties
Solution Approach 2:
The patent applies local quality by incorporating specific maleimide compounds that have low polarity characteristics into the resin composition. These maleimide segments locally reduce the overall polarity of the cured film, achieving low dielectric properties while maintaining the adhesion provided by the polyimide resin matrix
3Object-affected harmful factors
If polyimide resin is used in photosensitive resin composition, then low dielectric constant properties are improved, but developability becomes insufficient
Solution Approach 1:
The patent creates a composite system combining polyimide resin with maleimide compounds and polymerizable compounds. The maleimide compounds provide reactive groups that ensure sufficient developability, while the polyimide resin provides the low dielectric constant properties. This composite approach resolves the contradiction between developability and dielectric properties
Solution Approach 2:
The maleimide compounds act as intermediaries that bridge the polyimide resin and the polymerizable compounds. They provide the necessary reactivity for photo-curing and developability while maintaining the low polarity characteristics of the polyimide resin, thus enabling both good developability and low dielectric constant properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low-temperature curing with excellent adhesion and developability, resulting in a cured product with low dielectric constant properties suitable for high-frequency electrical signals.
Implementation Method 1
a curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern
Data Source
AI summary
A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.