Photosensitive Polyimide Resin for UV Curing 3D Printing
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Solution Overview
Problem
Current 3D printing technologies using photosensitive resins face challenges with mechanical strength, heat resistance, and complex preparation processes, particularly with polyimide materials which have excellent thermal stability but poor solubility and require high-temperature post-treatment.
Innovation Solution
A photosensitive polyimide resin is developed for UV curing-based 3D printing, comprising 40-60 parts by weight of active group-containing polyimide resin, 20-50 parts by weight of organic activator, and 2-5 parts by weight of photoinitiator, with specific raw materials and a simplified preparation method involving grinding and condensation reactions, allowing for use in conventional printers without high-temperature imidization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide resin is used for 3D printing, then heat resistance and thermal stability are improved, but solubility and processing ease deteriorate
Solution Approach 1:
The patent modifies the chemical structure of polyimide by introducing photosensitive groups (acrylate, methacrylate, or vinyl groups) onto the polyimide chains. This parameter change enables the material to undergo photopolymerization, transforming it from a non-soluble, difficult-to-process material into a UV-curable resin that can be processed at lower temperatures and remains soluble during printing before curing.
Solution Approach 2:
The patent creates a composite material system combining polyimide backbone with photosensitive functional groups. This composite structure maintains the excellent thermal stability and heat resistance of polyimide while adding UV curability, allowing the material to be processed like conventional photosensitive resins but cured to achieve polyimide's superior thermal properties.
2Temperature
If conventional polyimide is used, then thermal stability is improved, but dimensional stability during printing deteriorates
Solution Approach 1:
The patent performs preliminary action by incorporating photosensitive groups into the polyimide structure before printing. This allows the material to remain stable during storage and handling in soluble form, then undergo rapid crosslinking upon UV exposure during or after printing, achieving dimensional stability through pre-prepared photopolymerizable groups rather than requiring post-printing high-temperature treatment.
3Strength
If high-temperature post-treatment is applied, then mechanical strength is improved, but energy consumption and process complexity increase
Solution Approach 1:
The patent replaces the thermal field (high-temperature heating) with an optical field (UV light irradiation). Instead of using high-temperature ovens or furnaces to cure and strengthen the printed parts, the material is irradiated with UV light at ambient or moderate temperatures, dramatically reducing energy consumption while achieving the same crosslinking and strengthening effect.
Solution Approach 2:
The patent utilizes photopolymerization phase transition, where UV irradiation triggers rapid crosslinking transformation from liquid/soluble state to solid/cured state. This phase transition occurs at much lower temperatures than conventional thermal curing, reducing energy requirements while maintaining the mechanical strength enhancement effect.
4Reliability
If complex preparation process is used, then material performance is improved, but ease of operation deteriorates
Solution Approach 1:
The patent merges multiple functions into a single material system: the polyimide provides thermal stability and mechanical strength, while the integrated photosensitive groups provide UV curability and dimensional stability. This merging eliminates the need for separate preparation steps to add curing functionality, simplifying the overall process while maintaining excellent material performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a resin with excellent dimensional stability, high strength, good heat resistance, and simplified preparation, enabling the production of complex three-dimensional objects with reduced waste and environmental impact.
Implementation Method 1
Under the irradiation of ultraviolet light with a certain wavelength (x=325 nm) and intensity (w=30 mw), the liquid photosensitive resin will undergo rapid photopolymerization, and experience a sharp increase in the molecular weight, such that the material is converted from liquid state into solid state.
Implementation Method 2
a condensation reaction between a carboxyl group and an alcohol group to form an imide ring and water
Data Source
AI summary
A photosensitive polyimide resin for ultraviolet curing-based three-dimensional printing, which is prepared from 40-60 parts by weight of an active group-containing polyimide resin; 20-50 parts by weight of an organic activator; and 2-5 parts by weight of a photoinitiator. This application further provides a method for preparing the photosensitive polyimide resin.