Photosensitive Polyimide Composition Low-Temperature Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current photosensitive resin compositions for semiconductor elements face challenges in achieving high resolution and mechanical properties while being cured at low temperatures, with existing materials lacking in adhesiveness and heat resistance, and requiring high-temperature imidization processes that can damage substrates and oxidize wiring.
Innovation Solution
A polymer with specific structural units allowing solubility in aqueous alkaline solutions, used in both positive and negative photosensitive resin compositions, which includes crosslinking agents and a photosensitizer to form fine patterns with improved mechanical properties and adhesiveness, even when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature imidization process is used to obtain target polyimide film, then the polyimide film can be formed with good properties, but the underlying substrate is constrained and wiring copper is oxidized
Solution Approach 1:
The patent changes the imidization temperature parameter from conventional high temperature (>300°C) to low temperature (80-150°C) by using a novel photosensitive polyimide composition that undergoes imidization through UV irradiation rather than thermal processing, thereby avoiding substrate damage and copper oxidation while still forming high-quality polyimide films
Solution Approach 2:
The patent replaces the thermal imidization mechanism with a photochemical imidization mechanism. Instead of using heat to drive the imidization reaction, the composition uses photosensitive groups that undergo chemical transformation upon UV irradiation, initiating imidization at low temperatures and eliminating the need for high-temperature processing equipment
2Strength
If photosensitive polyimide composition is used to form patterns, then the insulating property and mechanical strength are improved, but the composition requires high-temperature curing which damages the substrate
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature to low temperature (80-150°C) by employing a photosensitive polyimide composition that cures through UV irradiation. The composition contains photosensitive groups that trigger imidization and crosslinking reactions upon light exposure, enabling pattern formation with excellent mechanical strength without high-temperature damage to the substrate
Solution Approach 2:
The patent creates a multi-functional photosensitive polyimide composition that simultaneously provides: (1) photosensitivity for pattern formation, (2) imidization capability at low temperature, (3) crosslinking for enhanced mechanical strength, and (4) solubility control for good pattern definition. This universal composition eliminates the need for separate high-temperature processing steps
3Temperature
If conventional photosensitive resin composition is used, then the composition can be processed, but the mechanical properties and adhesiveness are insufficient when cured at low temperature
Solution Approach 1:
The patent employs a composite photosensitive polyimide composition containing multiple functional components: polyamic acid or polyimide with carboxyl groups, photosensitive groups (ester bonds or carbonic ester bonds), and crosslinking agents. This composite structure enables low-temperature curing while achieving excellent mechanical properties and adhesiveness through synergistic interactions between the components
Solution Approach 2:
The patent introduces crosslinking agents as intermediary substances that facilitate low-temperature curing. These crosslinking agents contain reactive groups (isocyanate, epoxy, or carboxyl groups) that form crosslinked networks with the polyimide chains upon UV irradiation, providing the necessary mechanical strength and adhesiveness without requiring high-temperature processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer-based compositions enable the formation of high-resolution, fine patterns with excellent mechanical properties and adhesiveness, suitable for semiconductor applications, without the need for high-temperature processing, thus enhancing the reliability of electronic components.
Implementation Method 1
a positive photosensitive resin composition, a negative photosensitive resin composition
Data Source
AI summary
Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of -CO- and -SO2-; X1 is a tetravalent organic group; and 1 is 0 or 1; and X2 is a divalent organic group.