Photosensitive Polymer Conformability in PCB Resist Patterns
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Solution Overview
Problem
Photosensitive resin compositions used in printed wiring board manufacturing lack excellent conformability on circuit forming substrates, which is essential for forming high-resolution resist patterns with good peeling characteristics.
Innovation Solution
A novel polymer with structural units represented by Formula (I) and a carboxy group is used in a photosensitive resin composition, combined with a binder resin, photopolymerizable compounds, and photopolymerization initiators to enhance conformability and peeling characteristics during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional photosensitive resin compositions are used, then the manufacturing process is simple, but the conformability on circuit forming substrates is poor
Solution Approach 1:
The patent uses a composite resin system combining binder resin (polyester, polyacrylic, or polyvinylidene fluoride type) with the specific polymer containing Formula (I) structural units and carboxy groups. This composite approach enables excellent conformability to circuit forming substrates while maintaining manufacturing feasibility through established lamination processes.
2Adaptability or versatility
If high conformability is achieved through polymer modification, then conformability improves, but the structural complexity of the polymer increases
Solution Approach 1:
The patent introduces specific functional groups (carboxy groups) and structural units (Formula (I)) at localized positions within the polymer chain rather than uniformly modifying the entire polymer structure. This localized functionalization achieves excellent conformability through specific molecular interactions while keeping the overall polymer structure relatively simple and manageable.
3Manufacturing precision
If excellent peeling characteristics are achieved, then resist pattern quality improves, but the resin composition becomes more complex
Solution Approach 1:
The patent achieves excellent peeling characteristics by controlling the content of structural units represented by Formula (I) within a specific range (5-50 mass%) and adjusting the carboxy group content accordingly. By optimizing these compositional parameters within defined ranges, the resin achieves superior peeling properties without requiring overly complex multi-component systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel polymer composition achieves improved conformability and peeling characteristics, enabling the formation of high-resolution resist patterns with enhanced alkali developability and resistance, suitable for forming wiring patterns through etching or plating treatments.
Implementation Method 1
a photopolymerizable compound; and a photopolymerization initiator... irradiating at least a portion of the photosensitive layer with actinic light to form a photocured part
Data Source
AI summary
An aspect of the present disclosure relates to a polymer including a structural unit represented by the following Formula (I) and a structural unit having a carboxy group. In Formula (I), R1 represents a hydrogen atom or a methyl group; M represents an alkylene group or an alkylene oxide chain; and R2 represents an alkyl group or an aryl group.