Photosensitive Polymer Resist Composition for High-Resolution Patterns
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Solution Overview
Problem
There is a growing demand for technologies that can form high-resolution and high-sensitivity resist patterns, particularly in large-size and thin-film type displays, but existing solutions fall short in achieving the necessary resolution and sensitivity.
Innovation Solution
A novel photosensitive polymer with a specific repeating unit structure, combined with a photoacid generator and solvent, is used to create a resist composition that forms high-resolution and high-sensitivity resist patterns without the need for post-exposure baking, facilitating improved film formability and adhesion to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing photosensitive polymers are used, then the resist composition can be prepared, but the resolution and sensitivity of the formed resist pattern are insufficient
Solution Approach 1:
The patent modifies the chemical structure of the photosensitive polymer by introducing specific repeating units with formulas (1) and (1A), changing parameters such as molecular weight (3,000-50,000), aromatic group types (Ar1, Ar2), and substituent patterns to simultaneously improve resolution and sensitivity of the resist pattern
Solution Approach 2:
The patent creates a composite resist composition by combining the specifically structured photosensitive polymer with a photoacid generator and solvent, where each component contributes different properties that collectively achieve both high resolution and high sensitivity in the resist pattern
2Manufacturing precision
If post-exposure baking is performed to improve pattern quality, then the resist pattern quality improves, but processing time and costs increase
Solution Approach 1:
The patent extracts and eliminates the post-exposure baking step from the resist processing sequence by designing a photosensitive polymer that achieves sufficient pattern quality through exposure alone, thereby reducing processing time and costs while maintaining pattern quality
Solution Approach 2:
The patent incorporates preliminary structural design in the photosensitive polymer molecule (specific repeating units with defined molecular weight and aromatic groups) that enables the material to self-optimize during exposure without requiring subsequent thermal processing to achieve the desired pattern quality
3Ease of manufacture
If conventional photosensitive polymers are used, then the resist composition can be applied, but film formability and adhesion to substrates are insufficient
Solution Approach 1:
The patent optimizes the molecular weight parameter (3,000-50,000) and structural parameters (aromatic groups, substituent types and positions) of the photosensitive polymer to achieve an optimal balance between film forming capability during coating and adhesion strength to the substrate after processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described resist composition enables the formation of high-resolution and highly sensitive resist patterns with perpendicular edge regions, reducing processing costs and time, and improving the overall quality of the resist patterns.
Implementation Method 1
a novel photosensitive polymer with a specific repeating unit structure, combined with a photoacid generator and solvent, is used to create a resist composition that forms high-resolution and high-sensitivity resist patterns
Data Source
AI summary
A photosensitive polymer includes a repeating unit represented by Formula 1 and the photosensitive polymer has a weight average molecule weight of from about 3,000 to about 50,000: