Positive-Type Photosensitive Resin Composition Adhesion Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing positive-type photosensitive resin compositions have poor storage stability and reduced sensitivity, particularly after high-temperature heating treatments, due to the decomposition of typical silane coupling agents used in them.
Innovation Solution
A positive-type photosensitive resin composition comprising specific polymers, quinonediazide compounds, silane coupling agents with aromatic rings, and solvents, which provides enhanced storage stability and adhesion properties by using silane coupling agents with alkoxysilyl groups and epoxy, oxetanyl, methacryloxy, acryloxy, amino, amide, or mercapto groups, and heat-resistant polymers like polyimide and polybenzoxazole precursors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If typical silane coupling agents with amino groups bound by aliphatic hydrocarbon groups are used, then adhesion improvement is achieved, but storage stability and photo sensitivity are reduced due to decomposition by heating treatment
Solution Approach 1:
The patent changes the chemical structure parameters of the silane coupling agent by replacing aliphatic hydrocarbon groups with aromatic rings (specifically phenylene or naphthalene-1,4-diyl groups). This structural modification enhances thermal stability and prevents decomposition during heating treatment, while maintaining adhesion improvement capabilities through the retained amino groups and alkoxysilyl groups.
Solution Approach 2:
The patent creates a composite structure within the silane coupling agent by combining multiple functional groups (alkoxysilyl groups, amino groups, and aromatic ring structures) into a single molecular framework. This composite design allows the molecule to simultaneously provide adhesion enhancement through amino groups and thermal stability through aromatic structures, resolving the contradiction between adhesion and storage stability.
2Strength
If typical silane coupling agents are used to improve adhesion, then adhesion property is enhanced, but sensitivity is reduced after high-temperature heating treatment
Solution Approach 1:
The patent modifies the thermal stability parameter of the silane coupling agent by introducing aromatic ring structures. This change prevents decomposition at high temperatures (350°C or higher), thereby maintaining photo sensitivity and preventing the reduction in manufacturing precision that would otherwise occur after heating treatment.
3Temperature
If heat-resistant resin precursors like polyimide and polybenzoxazole are used, then heat resistance is achieved, but adhesion property after high-temperature heating treatment is reduced
Solution Approach 1:
The patent introduces a specially designed silane coupling agent as an intermediary substance between the heat-resistant resin precursor and the substrate. This coupling agent acts as a bridge that maintains strong bonding across the interface even after high-temperature heating, preventing the adhesion loss that occurs with conventional heat-resistant resins.
Solution Approach 2:
The patent changes the chemical composition parameters of the resin system by incorporating silane coupling agents with specific structures (aromatic rings, amino groups, alkoxysilyl groups) into the heat-resistant resin precursor formulation. This modification enables the resin system to maintain both heat resistance and adhesion properties after high-temperature processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent storage stability and photo sensitivity stability, maintaining excellent adhesion with substrates even after high-temperature heating treatments at 350°C or higher, and in air environments.
Implementation Method 1
a quinonediazide compound
Implementation Method 2
a silane coupling agent having an alkoxysilyl group
Data Source
AI summary
Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350°C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.