Photosensitive Resin Composition for 5G Insulating Layers

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Solution Overview

Problem

Conventional polyimide and polybenzoxazole resins used in semiconductor packaging exhibit poor dielectric properties, leading to signal deterioration and delay issues, particularly in 5G applications, and existing photosensitive polymers with aromatic polyester skeletons lack photolithography capabilities.

Innovation Solution

A photosensitive resin composition incorporating an aromatic polyester imide structure, a photopolymerization initiator, and a thermal radical polymerization initiator, along with a (meth)acryloyl compound, which provides low dielectric properties and photolithography capabilities, suitable for forming insulating layers and protective films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If polyimide or polybenzoxazole resin is used for surface protective film and interlayer insulating film, then heat resistance and electrical property are improved, but dielectric property deteriorates

Engineering Contradiction:

Improveheat resistanceVSAvoiddielectric property

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent uses a composite resin composition containing aromatic polyester imide main chain structure combined with photosensitive groups (carboxylic acid groups that can undergo photolysis). This composite structure integrates the heat resistance of polyimide/polybenzoxazole with the photolithography capability and improved dielectric properties of aromatic polyester, resolving the contradiction between thermal stability and electrical performance

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the chemical structure parameters by introducing aromatic polyester imide segments with specific ratios (5-50 mol%) into the resin composition. This parameter adjustment optimizes the balance between heat resistance and dielectric properties, achieving low dielectric constant (3.2 or less at 10 GHz) while maintaining excellent thermal stability

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If photosensitive polymer with aromatic polyester skeleton is used, then photolithography capability is improved, but heat resistance deteriorates

Engineering Contradiction:

Improvephotolithography capabilityVSAvoidheat resistance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent creates a composite resin system where aromatic polyester imide segments provide heat resistance while photosensitive carboxylic acid groups enable photolithography. The synergistic combination maintains both photolithography capability and high-temperature resistance, achieving curing temperature of 200°C or less while withstanding subsequent high-temperature processing steps

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If conventional resin is used for high-density wiring layer, then manufacturing is simplified, but signal transmission quality deteriorates

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidsignal transmission quality

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the dielectric parameters of the resin by incorporating aromatic polyester imide structures that reduce dielectric constant and dissipation factor. This enables high-frequency signal transmission (5G bands up to 100 GHz) while maintaining ease of manufacturing through standard photolithography processes, eliminating the need for complex material modifications

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition achieves a low dielectric constant, low moisture absorption, and high insulation reliability, enabling the production of reliable electronic components for 5G applications with improved pattern formability and heat resistance.

Implementation Method 1

a photopolymerization initiator and a thermal radical polymerization initiator, in which when the resin including an aromatic polyester imide structure represented by Formula (1) does not include a group represented by Formula (2), the resin composition includes a (meth)acryloyl compound

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

a photopolymerization initiator and a thermal radical polymerization initiator

Methodology Applied

Scientific EffectThermal polymerization:

Data Source

PatentUS20230259026A1Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin composition

Publication Date: 2023.08.17 RESONAC CORP

AI summary

A photosensitive resin composition used for forming an insulating layer includes a resin including an aromatic polyester imide structure, a photopolymerization initiator and a thermal radical polymerization initiator, and when the resin including an aromatic polyester imide structure does not include a (meth)acryl group, the resin composition includes a (meth)acryloyl compound.