Photosensitive Resin Composition Low-Temperature Curing

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Solution Overview

Problem

Current photosensitive resins used in high-tech industries, such as semiconductor production, face challenges with mechanical and insulation properties at low temperatures, hydrolysis issues, adhesion problems, and insufficient chemical resistance, leading to thermal damage and peeling during curing processes.

Innovation Solution

A photosensitive resin composition incorporating a poly(imide-benzoxazine) block copolymer with specific repeat units and a photo-curable multifunctional acrylic compound, which enables intermolecular crosslinking at low temperatures, providing excellent mechanical and insulation properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional photosensitive resins (polyamide acid, polyamic acid) are used, then adhesion to substrate is improved, but thermal stability and chemical resistance deteriorate due to hydrolysis and high temperature application

Engineering Contradiction:

Improveadhesion to substrateVSAvoidthermal stability and chemical resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent employs a composite material system consisting of polyamic acid resin combined with specific inorganic particles (such as silane-modified particles). This composite structure allows the organic polyamic acid to provide adhesion while the inorganic particles contribute thermal stability and chemical resistance, resolving the contradiction between adhesion and reliability under thermal/chemical stress

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters by incorporating crosslinking agents and controlling the molecular weight and functional group distribution of the polyamic acid resin. These parameter changes enhance the resin's resistance to hydrolysis and thermal degradation while maintaining adhesion properties, thus improving reliability without sacrificing strength

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If photosensitive resin is applied for ultrafine patterning, then manufacturing precision is improved, but thermal damage to semiconductor device occurs during heat treatment

Engineering Contradiction:

Improveultrafine patterning capabilityVSAvoidthermal damage to semiconductor device

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces photosensitive resins with modified curing characteristics by adjusting the glass transition temperature (Tg) and curing temperature parameters. The resin composition is designed to cure at lower temperatures (below 200°C) while achieving the required crosslinking density for ultrafine patterning, thus preventing thermal damage to semiconductor devices

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional high-temperature thermal curing mechanisms with photo-curing mechanisms. By using photoinitiators that activate at lower temperatures and designing resin systems that undergo polymerization upon light exposure rather than heat treatment, the patent achieves ultrafine patterning without subjecting semiconductor devices to damaging thermal stress

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If photosensitive resin requires high temperature curing, then mechanical properties are improved, but thermal damage to substrate occurs

Engineering Contradiction:

Improvemechanical properties of cured filmVSAvoidcuring temperature

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent replaces thermal energy with optical energy as the curing mechanism. Photoinitiators absorb specific wavelengths of light and initiate polymerization reactions at ambient or low temperatures, eliminating the need for high-temperature curing while maintaining mechanical property development through controlled crosslinking

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent modifies the resin composition to include photoinitiators and adjust molecular weight, functional group density, and crosslinking architecture to achieve optimal mechanical properties at low curing temperatures. The glass transition temperature and crosslinking density are carefully controlled to ensure sufficient mechanical strength without requiring thermal energy input

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition allows for the formation of cured films with superior mechanical and insulation properties at temperatures below 200°C, enhancing adhesion and chemical resistance, and enabling reliable use in semiconductor devices and displays.

Implementation Method 1

a photo-curable multifunctional acrylic compound

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

enables intermolecular crosslinking at low temperatures, providing excellent mechanical and insulation properties

Methodology Applied

Scientific EffectCrosslinking: Chemical Bonding

Data Source

PatentUS11640111B2Photosensitive resin composition and cured film comprising the same

Publication Date: 2023.05.02 LG CHEM LTD

AI summary

A photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C.