Photosensitive Resin Composition for Low-Temperature Cyclodehydration
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Solution Overview
Problem
The challenge is to develop a photosensitive resin composition that maintains high adhesiveness and chemical resistance under high temperature and high humidity conditions, while allowing for low-temperature cyclodehydration to prevent substrate damage in semiconductor device manufacturing.
Innovation Solution
A photosensitive resin composition comprising a polybenzoxazole precursor, a sensitizer, a solvent, a cross-linking agent, and a heterocyclic compound with hydroxyl, alkoxy, or carboxyl groups, which is applied, exposed to light, developed with an aqueous alkaline solution, and heat-treated at 250°C or less to achieve a high cyclodehydration ratio and excellent film properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cyclodehydration is performed at high temperatures, then the cyclodehydration ratio and chemical resistance improve, but substrate damage occurs and manufacturing cost increases
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperatures (350-450°C) to low temperatures (250°C or lower), achieving high cyclodehydration ratio (90% or more) and excellent chemical resistance without causing substrate damage. This parameter change resolves the contradiction between achieving high reliability and avoiding harmful effects.
Solution Approach 2:
The patent uses a composite resin composition containing polybenzoxazole precursor, polyimide precursor, and specific additives (phosphoric acid, carboxylic acid, or sulfuric acid) that enable low-temperature cyclodehydration. The composite nature of the material system allows achieving high cyclodehydration ratio at low temperatures, resolving the contradiction between chemical resistance and substrate damage.
2Object-affected harmful factors
If cyclodehydration is performed at low temperatures, then substrate damage is prevented, but adhesiveness under high temperature and high humidity conditions deteriorates
Solution Approach 1:
The patent changes the temperature parameter to low temperatures (250°C or lower) while maintaining high cyclodehydration ratio (90% or more), achieving both substrate damage prevention and sufficient adhesiveness under high temperature and high humidity conditions. This resolves the contradiction between avoiding substrate damage and maintaining reliability.
Solution Approach 2:
The patent employs a composite resin composition with polybenzoxazole precursor, polyimide precursor, and specific additives that work synergistically to provide both low-temperature processability and high adhesiveness under harsh conditions, resolving the contradiction between substrate protection and bond strength.
3Manufacturing precision
If conventional polybenzoxazole precursor is used, then high cyclodehydration ratio is achieved, but sufficient adhesiveness under high temperature and high humidity cannot be obtained
Solution Approach 1:
The patent creates a composite resin composition combining polybenzoxazole precursor, polyimide precursor, and specific additives (phosphoric acid, carboxylic acid, or sulfuric acid) that work synergistically to achieve both high cyclodehydration ratio (90% or more) and sufficient adhesiveness under high temperature and high humidity conditions, resolving the contradiction between manufacturing precision and reliability.
Solution Approach 2:
The patent introduces phosphoric acid, carboxylic acid, or sulfuric acid as intermediary substances that facilitate the cyclodehydration reaction at low temperatures while also enhancing the adhesiveness of the cured film under high temperature and high humidity conditions, resolving the contradiction between cyclodehydration efficiency and bond strength.
4Reliability
If high temperature curing is used, then excellent film properties are obtained, but manufacturing cost and energy consumption increase
Solution Approach 1:
The patent changes the curing temperature parameter from conventional high temperatures (350-450°C) to low temperatures (250°C or lower), achieving high cyclodehydration ratio (90% or more) and excellent film properties including adhesion, chemical resistance, and mechanical strength. This parameter change reduces energy consumption and manufacturing cost while maintaining high reliability.
Solution Approach 2:
The patent uses a composite resin composition with polybenzoxazole precursor, polyimide precursor, and specific additives that enable low-temperature curing (250°C or lower) while achieving excellent film properties comparable to or better than high-temperature cured films, resolving the contradiction between film quality and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a pattern-cured film with high adhesiveness and chemical resistance at low temperatures, ensuring reliable electronic components by maintaining film properties comparable to those achieved at higher curing temperatures.
Implementation Method 1
a production process at low temperatures has been desired. However, a polybenzoxazole precursor disclosed in Non-Patent Document 1 is required to be subjected to a cyclodehydration reaction at high temperatures during a heat-treatment step of forming a pattern-cured film
Implementation Method 2
a photosensitive resin composition which is excellent in adhesiveness, heat resistance and chemicals resistance under high temperature and high humidity conditions, and is capable of obtaining a well-shaped pattern
Data Source
AI summary
A photosensitive resin composition including: (a) a polybenzoxazole precursor; (b) a photosensitizer; (c) a solvent; (d) a cross-linking agent; and (e) a heterocyclic compound including a hydroxyl group, an alkoxy group or a carboxyl group within a molecule.