Photosensitive Resin Composition for Fine Conductive Patterns

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Solution Overview

Problem

The existing methods for forming fine electrically conductive patterns using photosensitive resin compositions with silver fine particles coated with carbon substances result in poor appearance and reliability issues, especially when used on substrates with organic components, due to residue formation.

Innovation Solution

A photosensitive resin composition comprising electrically conductive particles with a carbon surface coating, an alkali-soluble resin containing an acid-dissociation group, and a metal chelate compound, which prevents particle fusion and enhances pattern resolution and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If silver fine particles coated with carbon simple substance and/or carbon compound are used to form fine patterns, then fine pattern resolution is achieved, but residues are formed on substrates particularly on films containing organic components

Engineering Contradiction:
Improvepattern resolutionVSAvoidresidue formation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The invention changes the chemical composition parameters of the photosensitive resin by incorporating specific components (metal chelate compounds, alkali-soluble resins with acid-dissociation groups, and non-alkali-soluble resins) that modify the development characteristics and reduce residue formation while maintaining fine pattern resolution

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite photosensitive resin composition combining multiple resin types (alkali-soluble and non-alkali-soluble), metal chelate compounds, and specifically controlled silver particles with carbon coating, creating a material system that achieves both fine pattern formation and reduced residues on organic substrates

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If electrically conductive particles with finer particle size are used to form super fine patterns of 5 μm or less, then pattern fineness is improved, but particle agglomeration becomes more likely

Engineering Contradiction:
Improvepattern finenessVSAvoidparticle dispersion stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The invention introduces surface-coated electrically conductive particles where a carbon coating layer acts as an intermediary between the metal core and the photosensitive resin matrix, preventing direct interaction that causes agglomeration while maintaining electrical conductivity and enabling fine pattern formation

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention controls the particle size parameter within a specific range (0.01-10 μm, preferably 0.05-5 μm) and modifies surface properties through coating, achieving a balance between pattern fineness and dispersion stability by optimizing these physical parameters

Inventive Principle:
Principle #35Parameter changes

3Reliability

If carbon-coated silver fine particles are used to prevent particle fusion, then electrical conductivity is maintained, but residues are formed on organic component films

Engineering Contradiction:
Improveelectrical conductivityVSAvoidresidue formation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The invention modifies the chemical environment parameters during development by introducing metal chelate compounds and alkali-soluble resins with acid-dissociation groups, changing the development mechanism to reduce residue formation while preserving the carbon-coated particle structure and electrical conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a transferable pattern by using the carbon-coated particles as a stable conductive element that can be precisely positioned through photolithography, then transferred to the substrate with minimal residue, effectively copying the desired pattern without leaving harmful remnants

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a fine conductive pattern with good appearance and high reliability by preventing particle fusion and residue formation, while maintaining desired electrical conductivity.

Implementation Method 1

a metal chelate compound (C)

Methodology Applied
Scientific EffectChelation:

Implementation Method 2

an alkali-soluble resin (B) containing an acid-dissociation group

Methodology Applied
Scientific EffectAcid-base dissociation:

Implementation Method 3

UV light or the like is irradiated thereto through a photomask on which a shape of a fine circuit pattern is drawn, to form exposed portions and unexposed portions on the coating film

Methodology Applied
Scientific EffectPhotolithography: Photopolymerisation

Implementation Method 4

electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound

Methodology Applied
Scientific EffectSurface coating: Coatings

Data Source

PatentUS11422464B2Photosensitive resin composition, method of producing electrically conductive pattern, substrate, touch panel, and display
Publication Date: 2022.08.23 TORAY INDUSTRIES INC
  • US11422464B2 patent drawing
  • US11422464B2 patent drawing

AI summary

A photosensitive resin composition includes electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound; an alkali-soluble resin (B) containing an acid-dissociation group; and a metal chelate compound (C) wherein the metal chelate compound (C) includes at least one selected from the group consisting of Au, Ag, Cu, Cr, Fe, Co, Ni, Bi, Pb, Zn, Pd, Pt, Al, Ti, Zr, W and Mo.