Photosensitive Resin Composition for Fine Pattern Formation
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Solution Overview
Problem
Existing photosensitive resin compositions used for semiconductor chips and multilayer printed circuit boards have low resolution, limiting their application in highly integrated 3D packages, despite improved film properties.
Innovation Solution
A photosensitive resin composition comprising a polymer with silphenylene and fluorene skeletons, a phenol compound, a photoacid generator, and a benzotriazole or imidazole compound, capable of crosslinking, which forms a high-resolution film suitable for fine pattern formation even in thick films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silphenylene structure-containing silicone type polymer is used to improve film properties, then film flexibility and coating quality are improved, but resolution deteriorates
Solution Approach 1:
The patent changes the chemical structure parameters of the polymer by incorporating both silphenylene units (for film flexibility) and fluorene units (for resolution). This structural modification allows the material to simultaneously achieve good film properties and high resolution, resolving the contradiction between film quality and pattern precision.
Solution Approach 2:
The patent creates a composite polymer structure containing both silphenylene and fluorene moieties within the same polymer chain. This composite approach combines the beneficial properties of both structural units: silphenylene provides film flexibility and coating quality, while fluorene contributes to high resolution and perpendicular profile formation.
2Volume of moving object
If thick films are formed to ensure adequate coverage, then film thickness and coverage are improved, but pattern resolution deteriorates
Solution Approach 1:
The patent modifies the polymer structure by incorporating fluorene units which enable the formation of perpendicular profiles even in thick films. This structural change allows thick films to maintain high resolution patterns, resolving the contradiction between film thickness and pattern precision.
Solution Approach 2:
The patent achieves uniform perpendicular profile formation throughout the thickness of the film through the specific polymer structure. Each layer of the thick film develops the same high-resolution perpendicular profile characteristic, allowing thick films to maintain consistent pattern quality from top to bottom.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of fine size patterns with a perpendicular profile from thick films, enhancing the resolution and applicability in advanced packaging technologies.
Implementation Method 1
a photoacid generator
Implementation Method 2
a polymer comprising repeating units having the formula (A1) and repeating units of at least one type selected from repeating units having the formula (A2) and repeating units having the formula (A3)... having a crosslinking group or reactive site capable of crosslinking reaction in the molecule
Data Source
AI summary
A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.