Photosensitive Resin Composition for High-Density Resist Patterns
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Solution Overview
Problem
Existing photosensitive resin compositions are unsatisfactory for forming high-density resist patterns by direct imaging exposure due to inadequate sensitivity and resolution.
Innovation Solution
A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound with ethylenically unsaturated bonds, and specific pyrazoline derivatives as photopolymerization initiators, optimized for use with light having a peak in the wavelength range of 350 nm to 440 nm, enhancing sensitivity and resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing photosensitive resin compositions are used for direct imaging exposure, then the process is simple, but the sensitivity and resolution are insufficient for high-density patterns
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive resin composition by incorporating specific photopolymerizable compounds (acrylate and vinyl ether groups) and photopolymerization initiators (phenylboronic acid compounds and iodine compounds) to optimize the composition for 405 nm laser exposure, thereby achieving both high sensitivity and high resolution simultaneously
Solution Approach 2:
The patent creates a composite photosensitive resin system combining multiple photopolymerizable compounds (acrylate and vinyl ether types) with complementary photopolymerization initiators, where each component contributes specific properties that collectively achieve the required sensitivity and resolution for high-density patterns
2Length of stationary object
If the film thickness of the resist pattern is increased to thicken the conductor layer, then the conductor thickness increases to reduce voltage drop, but additional increases in sensitivity are required
Solution Approach 1:
The patent optimizes the photopolymerization initiation system using phenylboronic acid compounds and iodine compounds that are specifically effective at 405 nm wavelength, enabling high sensitivity that allows formation of thick resist patterns (10 μm or more) while maintaining high productivity
3Productivity
If direct imaging exposure is used to form resist patterns, then high productivity is achieved, but existing photosensitive resin compositions provide insufficient sensitivity and resolution
Solution Approach 1:
The patent tailors the photosensitive resin composition parameters specifically for 405 nm laser direct imaging exposure, using photopolymerizable compounds with appropriate absorption characteristics and photopolymerization initiators with maximum activity at this wavelength, achieving both high productivity and high resolution
Solution Approach 2:
The patent enables direct imaging exposure where the laser beam directly writes the pattern without a mask, copying the desired circuit pattern directly onto the resist through photopolymerization, achieving high productivity while the optimized composition ensures high resolution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-density resist pattern formation with improved sensitivity and resolution through direct imaging exposure, suitable for producing printed wiring boards with high-density wiring patterns.
Implementation Method 1
a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below... optimized for use with light having a peak in the wavelength range of 350 nm to 440 nm
Data Source
AI summary
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below,wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.