Photosensitive Resin Composition for High Insulation Reliability

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Solution Overview

Problem

Existing photosensitive resin compositions face challenges in achieving high insulation reliability, flexibility, and developability, particularly when using alkaline aqueous solutions, due to limitations in dielectric properties and substrate adhesion.

Innovation Solution

A resin composition combining a maleimide compound derived from dimer acid diamine and maleic anhydride with a reactive polycarboxylic acid resin, which is formed by reacting an epoxy resin with a polybasic acid anhydride, allowing for development with a weakly alkaline solution and providing high insulation reliability and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a maleimide compound including a dimer acid-derived diamine and maleic anhydride is used, then dielectric properties and moisture resistance are improved, but developability with alkaline aqueous solution deteriorates due to high hydrophobicity

Engineering Contradiction:
Improveinsulation reliabilityVSAvoiddevelopability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines a maleimide compound (I) with specific structural features (dimer acid-derived long-chain alkyl groups) with a reactive polycarboxylic acid resin (II) containing carboxyl groups. This composite resin composition achieves both high insulation reliability from the maleimide compound and good developability from the polycarboxylic acid resin's affinity with alkaline aqueous solutions.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent specifies precise compositional parameters: the maleimide compound (I) contains 20-80 mass% of dimer acid-derived long-chain alkyl groups, and the resin composition contains 5-50 mass% of the reactive polycarboxylic acid resin (II). By controlling these parameters, the patent optimizes the balance between hydrophobicity (for insulation) and hydrophilicity (for developability).

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If a carboxylate resin is used to achieve good developability, then developability is improved, but dielectric properties and moisture resistance deteriorate due to ester groups with high polarity

Engineering Contradiction:
ImprovedevelopabilityVSAvoiddielectric properties
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

Instead of using a carboxylate resin alone, the patent creates a composite system where the reactive polycarboxylic acid resin (II) provides developability through carboxyl groups, while the maleimide compound (I) provides dielectric properties through its hydrophobic dimer acid-derived alkyl chains. The synergistic combination resolves the contradiction between developability and dielectric properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent assigns different functional roles to different components: the maleimide compound (I) primarily provides dielectric properties and moisture resistance in the bulk material, while the reactive polycarboxylic acid resin (II) primarily provides developability at the interface with the alkaline aqueous solution. This local functional differentiation resolves the contradiction.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables a cured product with improved dielectric properties, flexibility, and insulation reliability, suitable for applications like solder resist and interlayer insulating materials, while maintaining good developability.

Implementation Method 1

the reactive epoxycarboxylate resin is a product of reaction between an epoxy resin (b-1) and a compound (b-2) having a polymerizable ethylenically unsaturated group and a carboxy group together in one molecule

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS20230374186A1Photosensitive resin composition, cured product thereof and multilayer material
Publication Date: 2023.11.23 NIPPON KAYAKU CO LTD
  • US20230374186A1 patent drawing
  • US20230374186A1 patent drawing
  • US20230374186A1 patent drawing

AI summary

A resin composition contains a maleimide compound (I) that is the product of a reaction between a diamine (a-1) derived from a dimer acid and maleic anhydride, and a reactive polycarboxylic acid resin (II) that is the product of a reaction between a reactive epoxycarboxylate resin, the reactive epoxycarboxylate resin being the product of a reaction between an epoxy resin (b-1) and a compound (b-2) having a polymerizable ethylenically unsaturated group and a carboxy group together in one molecule, and a polybasic acid anhydride (b-3).