Positive Photosensitive Resin Composition for Semiconductor Lithography
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Solution Overview
Problem
Current positive photosensitive resin compositions for semiconductor devices have limitations in sensitivity and resolution, particularly when used for forming heat-resistant films, and they often require organic solvents, which are environmentally undesirable.
Innovation Solution
A positive photosensitive resin composition is developed, comprising a hydroxypolyamide with specific repeating units, a photo-acid generator, a carboxylic acid compound, and an alcohol, which enhances sensitivity, resolution, and adhesion to silicon substrates, while eliminating the need for organic solvents by using an alkaline aqueous development process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive polyimide precursor composition is used, then heat resistance and adhesion are improved, but sensitivity and resolution deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters by introducing a polybenzoxazole precursor with specific repeating units (formula 1) combined with polyimide precursor in controlled ratios (0.1-10 mass%). This compositional parameter change enables both high heat resistance (Tg > 200°C) and high resolution (0.5μm line width) to be achieved simultaneously, resolving the contradiction between heat resistance and resolution.
2Reliability
If a photosensitive polyimide precursor composition is used, then heat resistance is improved, but sensitivity deteriorates
Solution Approach 1:
The patent creates a composite photosensitive resin composition containing both polybenzoxazole precursor (providing heat resistance with Tg > 200°C) and polyimide precursor (providing photosensitivity). The synergistic combination of these two different polymer precursors resolves the contradiction by allowing the polybenzoxazole component to provide heat resistance while the polyimide component maintains sensitivity, achieving both high heat resistance and high sensitivity simultaneously.
3Ease of operation
If an organic solvent-based development process is used, then development performance is improved, but environmental compatibility deteriorates
Solution Approach 1:
The patent changes the development process parameter from organic solvent-based to alkaline aqueous solution-based development. The composition is specifically designed with polybenzoxazole and polyimide precursors that exhibit controlled solubility in alkaline aqueous solutions, enabling effective pattern development without organic solvents. This parameter change achieves both good development performance and environmental compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high sensitivity and resolution in lithography, excellent adhesion to silicon substrates, and forms heat-resistant films without the use of organic solvents, addressing environmental concerns and improving the semiconductor device manufacturing process.
Implementation Method 1
a compound generating an acid by active actinic ray irradiation
Implementation Method 2
the exposed areas are dissolved in a developing solution
Implementation Method 3
subjected to heat imidization treatment to easily form a passivation film or an interlayer insulating film
Data Source
AI summary
A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).