Positive Photosensitive Resin Composition Low-Temperature Curing
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Solution Overview
Problem
Current positive photosensitive resin compositions for semiconductor devices face challenges in achieving high resolution and excellent mechanical characteristics at low temperatures, with issues related to copper migration and storage stability due to unblocked carboxyl groups and limited mechanical strength and elongation.
Innovation Solution
A positive photosensitive resin composition comprising an alkali-soluble resin with polyimide, polybenzoxazole, or polyamide-imide structures, a resin with a heterocyclic skeleton, a quinonediazide photosensitizer, and a solvent, which allows for fine pattern formation and high resolution while maintaining mechanical characteristics even when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a positive photosensitive resin composition uses an alkali-soluble polyimide and photoacid generator for low-temperature curing, then the curing temperature is reduced, but the breaking elongation and mechanical characteristics are insufficient
Solution Approach 1:
The patent combines multiple resin components (alkali-soluble polyimide, polyamic acid, and heterocyclic skeleton-containing resin) in a composite formulation. This composite approach allows the system to achieve both low-temperature curability and excellent mechanical properties including high breaking elongation, as each component contributes different functional characteristics that complement each other.
Solution Approach 2:
The patent modifies the chemical structure parameters of the resin components by introducing specific heterocyclic skeletons with nitrogen atoms and controlling the molecular weight ranges. These parameter changes enable the resin to maintain solubility for low-temperature processing while achieving superior mechanical characteristics through optimized molecular structure.
2Manufacturing precision
If a photosensitive polyimide material uses polyamic acid with photosensitive group for pattern formation, then the pattern can be formed, but high-temperature imidization treatment is required which restricts undercoat base material and oxidizes copper wiring
Solution Approach 1:
The patent performs preliminary imidization by incorporating pre-imidized polyimide structures into the resin composition before the photo-patterning process. This preliminary action eliminates the need for high-temperature post-curing imidization, allowing low-temperature processing that protects copper wiring from oxidation and expands material compatibility for undercoat base materials.
Solution Approach 2:
The patent replaces the thermal imidization process with a photochemical curing mechanism. By using photoacid generators that catalyze imidization at low temperatures upon light exposure, the system substitutes high-temperature thermal processing with low-temperature photochemical processing, thereby protecting temperature-sensitive components.
3Stress or pressure
If a positive photosensitive resin composition uses alkali-soluble polyimide with triazine or diazine skeleton for copper wire adhesiveness, then the adhesiveness with copper wire is excellent, but the breaking elongation and mechanical characteristics need improvement
Solution Approach 1:
The patent merges multiple resin systems with complementary properties: alkali-soluble polyimide for copper adhesiveness, polyamic acid for solubility and processability, and heterocyclic skeleton-containing resins for mechanical strength. This merging of materials achieves both excellent copper wire adhesiveness and high breaking elongation simultaneously.
4Reliability
If a polyimide resin composition uses carboxyl group-containing polyimide for surface protective film, then the film can be formed, but carboxyl groups cause copper migration requiring epoxy type crosslinking agent which reduces storage stability
Solution Approach 1:
The patent extracts or removes the problematic carboxyl groups from the polyimide structure by using pre-imidized polyimide and polyamic acid formulations that minimize free carboxyl groups. This extraction eliminates the copper migration issue without requiring additional crosslinking agents that would compromise storage stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of a cured film with excellent adhesiveness, heat resistance, and mechanical strength, suitable for use as an interlayer insulation or surface protective film in semiconductor devices, with improved chemical resistance and reliability.
Implementation Method 1
a photoacid generator, and a solvent, wherein the photoacid generator generates an acid by light
Implementation Method 2
an imidization treatment at a high temperature exceeding 300°C after a patterned film is formed is necessary
Data Source
AI summary
The present invention is a positive photosensitive resin composition comprising: (A-1) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (A-2) a resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, each of which has no alkali-soluble group and contains a heterocyclic skeleton having at least one or more nitrogen atoms at a molecular end; (B) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution; and (D) a solvent. This provides a positive photosensitive resin composition which is soluble in an alkaline aqueous solution, can form a fine pattern and can obtain high resolution, and has excellent mechanical characteristics even when cured at low temperatures.