Positive Photosensitive Resin Composition for Optical Devices
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Solution Overview
Problem
Conventional positive photosensitive resin compositions for producing collecting microlenses, white color filters, and optical waveguides face challenges in achieving high refractive index and transparency while maintaining sensitivity, resolution, and solvent resistance, especially after long-term storage and low-temperature curing.
Innovation Solution
A positive photosensitive resin composition comprising polysiloxane synthesized from organosilanes with carboxyl groups and metal compound-containing particles, combined with a naphthoquinone diazide compound and a solvent, which provides excellent dispersion stability and allows for high refractive index and transparency without compromising sensitivity or resolution, even after long-term storage at room temperature and low-temperature curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional photosensitive siloxane compositions or high refractive index materials are used, then high refractive index is achieved, but the cured film does not have adequately high refractive index and transparency
Solution Approach 1:
The patent uses a composite material system consisting of siloxane oligomer, metal oxide particles (TiO2, SiO2, ZrO2, SnO2), and photopolymerization initiator. This composite approach allows achieving refractive index of 1.65-2.00 and high transparency simultaneously, resolving the contradiction between refractive index and cured film quality
2Illumination intensity
If polyamide acid or phenolic hydroxyl group containing materials are used, then high refractive index is achieved, but transparency is deteriorated due to coloring
Solution Approach 1:
The patent changes the chemical composition parameters by using siloxane oligomer with specific molecular weight (100-10,000) and metal oxide particle combinations, avoiding polyamide acid and phenolic hydroxyl groups that cause coloring. This achieves both high refractive index (1.65-2.00) and high transparency without coloration
3Illumination intensity
If non-photosensitive materials are used, then high refractive index and high transparency are achieved, but the material requires wet etching or dry etching processing which complicates the process and deteriorates wiring portions
Solution Approach 1:
The patent replaces mechanical/chemical etching processes with photopolymerization-based patterning. The photosensitive resin composition can be directly patterned by photomask exposure and development, eliminating the need for wet etching or dry etching, thus simplifying the manufacturing process and protecting wiring portions from chemical or plasma damage
4Measurement precision
If conventional photosensitive resin composition is used, then sensitivity to exposure and resolution are maintained, but solvent resistance and stability after long-term storage at room temperature are compromised
Solution Approach 1:
The patent optimizes the composition parameters including siloxane oligomer molecular weight (100-10,000), metal oxide particle size (0.1-10 μm), and photopolymerization initiator type. The cured film achieves refractive index of 1.65-2.00, high transparency, excellent solvent resistance, and maintains sensitivity and resolution after long-term storage at room temperature
5Measurement precision
If conventional material is used, then high sensitivity to exposure is achieved, but high curing temperature is required which reduces productivity
Solution Approach 1:
The patent selects photopolymerization initiators with appropriate absorption characteristics and optimizes the curing temperature parameter. The system enables low-temperature curing (reducing from conventional high temperatures) while maintaining high sensitivity to exposure and resolution, thus improving productivity without compromising pattern formation quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high sensitivity, resolution, and solvent resistance, enabling the formation of cured films with improved refractive index and transparency, simplifying the manufacturing process by eliminating the need for etching and ensuring stability over time.
Implementation Method 1
a positive photosensitive resin composition which... is soluble in an alkaline aqueous solution... (b) a naphthoquinone diazide compound
Implementation Method 2
a polysiloxane synthesised by hydrolysing and partially condensing an organosilane represented by the following general formula (1)
Data Source
AI summary
A positive photosensitive resin composition including: a polysiloxane synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.