Photosensitive Resin Composition for Organic Layer Pattern Formation
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Solution Overview
Problem
Existing display devices using inorganic protective layers face limitations due to high dielectric constants and costly vacuum deposition processes, while chemically amplified resist-based organic layers require post-exposure baking and are susceptible to damage from short-wavelength ultraviolet light exposure.
Innovation Solution
A photosensitive resin composition comprising an acid-labile resin, a monomer, a photoacid generator, and a solvent, which can form patterns without post-exposure baking and is activated by longer wavelengths, reducing equipment damage and simplifying the exposure process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemically amplified resist is used to form organic layer pattern, then pattern formation capability is improved, but post-exposure baking process is required which increases manufacturing complexity
Solution Approach 1:
The patent extracts and eliminates the post-exposure baking step from the conventional chemically amplified resist process. By using a photosensitive resin composition that directly forms patterns upon light exposure without requiring thermal processing, the complex multi-step process is simplified to a single exposure step, reducing manufacturing complexity while maintaining pattern formation capability
Solution Approach 2:
The patent replaces the thermal mechanism (heating/baking) with a purely photochemical mechanism. Instead of using heat to activate the chemical reaction in the resist, the invention uses light exposure alone to trigger the solubility change and pattern formation, substituting a thermal process with an optical process
2Manufacturing precision
If short-wavelength ultraviolet light is used for exposure, then exposure precision is improved, but damage to exposure device occurs
Solution Approach 1:
The patent changes the wavelength parameter of the exposure light from short-wavelength UV to longer-wavelength visible light (such as blue light). This parameter change allows the use of less energetic photons that are sufficient for activating the photosensitive resin but do not cause damage to metal or mirror components of the exposure device, thereby eliminating the harmful effects while maintaining exposure precision
3Reliability
If inorganic protective layer is used, then protective function is improved, but dielectric constant is high which limits aperture ratio improvement
Solution Approach 1:
The patent uses an organic photosensitive resin composition as a composite alternative to inorganic protective layers. This organic material provides both the protective function and the low dielectric constant properties needed for high aperture ratio displays, combining multiple functions in a single material system
Solution Approach 2:
The patent changes the material composition parameter from inorganic to organic, which fundamentally alters the dielectric constant parameter. By using organic materials with inherently lower dielectric constants, the aperture ratio can be increased while maintaining adequate protective and insulating functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables pattern formation in display devices without the need for post-exposure baking and reduces damage to exposure devices by using longer wavelengths, improving the efficiency and cost-effectiveness of organic layer formation.
Implementation Method 1
A photosensitive resin, which participates in a photoreaction to change its solubility in a specific solvent, is used (utilized) to form such an organic layer pattern. The chemically amplified resist contains an acid-labile resin and a photoacid generator, and an acid (H+) is produced from the photoacid generator of a light-exposed area
Implementation Method 2
a photoreaction accelerator of about 1 wt % to about 5 wt %, wherein the acid-labile resin includes a repeating unit including an acid group, and a protecting group configured to protect the repeating unit
Data Source
AI summary
A photosensitive resin composition includes an acid-labile resin of about 5 wt % to about 25 wt %, a monomer of about 5 wt % to about 10 wt %, a photoacid generator of about 5 wt % to about 10 wt %, a photoreaction accelerator of about 1 wt % to about 5 wt %, and a solvent of about 50 wt % to about 84 wt %, wherein the acid-labile resin comprises a repeating unit containing an acid group, and a protecting group configured to protect the repeating unit.