Photosensitive Resin Composition for Printed Circuit Boards
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Solution Overview
Problem
The existing solder mask coatings for printed circuit boards require storage at temperatures lower than 5 degrees Celsius due to the reaction between epoxy resin and carboxyl groups, leading to increased storage costs and inefficiencies.
Innovation Solution
A photosensitive resin composition comprising carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, photosensitive prepolymer, photo-initiator, and coloring agent, which forms a dense cross-linking network structure upon ultraviolet exposure, eliminating the need for low-temperature storage by avoiding the use of epoxy resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as hardening agent in solder mask ink, then adhesion strength is improved, but storage stability deteriorates due to reaction between epoxy groups and carboxyl groups requiring low-temperature storage
Solution Approach 1:
The invention changes the chemical structure parameter of the epoxy compound from conventional epoxy resin to epoxy-modified (meth)acrylate, which contains both epoxy groups and (meth)acrylate groups. This structural modification allows the compound to maintain adhesion strength while eliminating the need for low-temperature storage by preventing premature reaction with carboxyl groups
Solution Approach 2:
The invention uses a composite approach by combining epoxy groups and (meth)acrylate groups within the same molecule (epoxy-modified (meth)acrylate), creating a material that exhibits both the adhesion properties of epoxy resins and the photo-curing characteristics of (meth)acrylates, while avoiding the storage stability issues
2Stability of the object's composition
If epoxy resin and carboxyl-containing epoxy acrylate are combined in solder mask ink, then cross-linking density is improved, but premature reaction occurs under normal temperature conditions
Solution Approach 1:
The invention modifies the chemical parameters by replacing conventional epoxy resin with epoxy-modified (meth)acrylate, which has both epoxy groups and (meth)acrylate groups. This structural change enables high cross-linking density through photo-curing while maintaining chemical stability during storage by preventing premature reaction with carboxyl groups
3Stability of the object's composition
If low-temperature storage is implemented for solder mask ink, then storage stability is improved, but storage cost increases
Solution Approach 1:
The invention changes the chemical composition parameter by using epoxy-modified (meth)acrylate instead of conventional epoxy resin, which allows the solder mask ink to be stored at normal temperatures while maintaining storage stability, thereby eliminating the need for costly low-temperature storage facilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The photosensitive resin composition enables improved alkali resistance, solder heat resistance, and thermal resistance for printed circuit boards, with enhanced storage stability at normal temperatures, maintaining adhesion strength and flexibility.
Implementation Method 1
Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation
Data Source
AI summary
A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.