Photosensitive Resin Composition Rectangular Cross-Section Plating
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Solution Overview
Problem
The challenge lies in creating a photosensitive resin composition that can form a resist pattern film with a rectangular cross-section for fine and dense wiring and bumps, while preventing mold residue adhesion and swelling during the production of plated formed products, especially when dealing with tin-silver alloy compounds.
Innovation Solution
A photosensitive resin composition comprising a polymer with an acid dissociative group, a photoacid generator, and a solvent mixture of propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate, which forms a resist pattern film with a rectangular cross-section, reducing residue adhesion and swelling during the plating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a conventional photosensitive resin composition is used to form a resist pattern film for fine and dense wiring and bumps, then the resist pattern film can be formed, but it cannot maintain a rectangular cross-section due to swelling and deformation, leading to poor plating quality
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive resin, specifically incorporating polymer (A) with acid dissociative groups and using a controlled solvent system (propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate in specific ratios). These parameter changes enable the resist to maintain its rectangular cross-section during plating while achieving fine and dense wiring patterns with high manufacturing precision
Solution Approach 2:
The patent creates a composite photosensitive resin system by combining polymer (A) with acid dissociative groups, photoacid generator (B), and a specific solvent mixture. This composite material formulation provides both the structural integrity to maintain rectangular cross-section and the photochemical properties needed for precise pattern formation in fine and dense wiring applications
2Productivity
If a resist pattern is used as a mold for plating to produce fine and dense plated formed products, then the plating can be formed, but mold residue easily adheres to the plated formed product, especially when it is a tin-silver alloy compound
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive resin composition, specifically using polymer (A) with acid dissociative groups and a controlled solvent system with less than 60% by mass of the specified solvent mixture. These parameter changes reduce the chemical affinity between the resist mold and tin-silver alloy plating, preventing residue adhesion while maintaining production efficiency
Solution Approach 2:
The patent introduces polymer (A) with acid dissociative groups as an intermediary material between the resist mold and the metal substrate. This intermediary creates a controlled interface that prevents harmful adhesion of tin-silver alloy residue to the plated formed product, solving the contamination problem while maintaining productive plating processes
3Stability of the object's composition
If the solvent content in the photosensitive resin composition is increased to improve coating uniformity, then the resin film can be applied smoothly, but the resist pattern film swells during plating, causing deformation and loss of rectangular cross-section
Solution Approach 1:
The patent optimizes the solvent content parameter to less than 60% by mass of the specified solvent mixture (propylene glycol monomethyl ether acetate and 3-methoxybutyl acetate). This parameter change achieves a balance where sufficient solvent remains for smooth coating uniformity, while the limited solvent content prevents excessive swelling during plating, thereby maintaining the rectangular cross-section of the resist pattern film
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively forms a resist pattern film with a rectangular cross-section, suppressing residue adhesion and swelling, thereby enhancing the production of plated formed products with improved resolution and resistance to plating solutions.
Implementation Method 1
photoacid generator (B)
Data Source
AI summary
A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.