Photosensitive Resin Composition Low-Temperature Ring Closure High Tg

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing photosensitive resin compositions for semiconductor elements face challenges in achieving high ring closure rates at low temperatures and maintaining high glass transition temperatures (Tg) in cured films, especially in thick layers and during repeated thermal curing processes.

Innovation Solution

A photosensitive resin composition combining a heterocyclic ring-containing polymer precursor with a thermal-base generator and an organic compound containing a Group 4 element, such as titanium or zirconium, along with an oxime compound as a photo-radical polymerization initiator, to facilitate high ring closure rates at low temperatures and maintain high Tg in cured films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a thermal-base generator is used to enable ring closure at low temperatures, then the ring closure rate improves, but the glass transition temperature (Tg) of the cured film decreases

Engineering Contradiction:

Improvering closure rateVSAvoidglass transition temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent uses a composite system combining a heterocyclic ring-containing polymer precursor with a thermal-base generator and a Group 4 element organic compound. This composite approach allows the thermal-base generator to facilitate ring closure at low temperatures while the Group 4 element compound counteracts the Tg reduction, achieving both high ring closure rate and high Tg simultaneously.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the chemical composition parameters by introducing a Group 4 element organic compound (titanium, zirconium, or hafnium compound) into the resin system. This parameter change modifies the curing characteristics to maintain high Tg while enabling low-temperature ring closure through thermal-base generation.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If a photo-base generator is used for crosslinking, then the reaction efficiency improves, but the crosslinking becomes insufficient in thick films due to light penetration limits

Engineering Contradiction:

Improvecrosslinking efficiencyVSAvoidcrosslinking uniformity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces the photo-base generator system with a thermal-base generator system. This substitution eliminates the light penetration limitation by using thermal energy instead of optical energy, allowing uniform crosslinking throughout thick films regardless of exposure wavelength or layer thickness.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If the resin composition is designed for high sensitivity and resolution, then the exposure quality improves, but the heat resistance of the cured film decreases

Engineering Contradiction:

Improveexposure qualityVSAvoidheat resistance

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

The patent creates a composite resin system that combines heterocyclic ring-containing polymer precursor with thermal-base generator and Group 4 element organic compound. This composite formulation achieves both high exposure sensitivity and resolution while maintaining high heat resistance through the synergistic effect of the components.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the resin composition parameters by incorporating specific ratios of heterocyclic ring-containing polymer precursor (20-100 mass%), thermal-base generator (0.1-50 mass%), and Group 4 element organic compound (0.1-20 mass%). These parameter adjustments optimize both exposure characteristics and thermal properties.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient ring closure at low temperatures and maintains high glass transition temperatures in cured films, improving exposure latitude and ensuring adequate crosslinking reactions regardless of layer thickness and exposure wavelength, while supporting repeated thermal curing in laminated RDL applications.

Implementation Method 1

a thermal-base generator; in a case of being heated to 40°C or higher

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 2

an oxime compound as a photo-radical polymerization initiator

Methodology Applied

Scientific EffectPhoto-radical polymerization: Photopolymerisation

Implementation Method 3

supporting repeated thermal curing in laminated RDL applications

Methodology Applied

Scientific EffectThermal curing: Heat Treatment

Data Source

PatentEP3492982B1Photosensitive resin composition, cured film, laminate, method for producing cured film, method for producing laminate, and semiconductor device

Publication Date: 2020.11.11 FUJIFILM CORP

Figure 1

AI summary

Provided are a photosensitive resin composition which allows ring closure to be made with a high ring closure rate even at a low temperature and which causes a cured film obtained by curing the photosensitive resin composition to have a high glass transition temperature, and a cured film, a laminate, a method for producing the cured film, a method for producing the laminate, and a semiconductor device in which the photosensitive resin composition is used. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor, a thermal-base generator, and an organic compound containing a Group 4 element.