Photosensitive Resin Composition for Ultrahigh Sensitivity
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Solution Overview
Problem
Current alkali-developing-type resist inks face challenges in achieving ultrahigh sensitivity for direct laser exposure methods and maintaining excellent alkali developability and heat control range, leading to issues with curing and solvent removal during the solder resist patterning process.
Innovation Solution
A photosensitive resin composition with a multi-branched molecular structure is developed, incorporating an acid group-containing vinyl ester resin and a photopolymerization initiator, where the resin is formed by reacting an epoxy group-containing radically-polymerizable unsaturated monomer with a polybasic anhydride and an acid-pendant-type epoxy vinyl ester compound, introducing multiple unsaturated double bonds and acid groups to enhance sensitivity and developability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an epoxy group-containing radically-polymerizable unsaturated monomer is reacted with an acid-pendant-type epoxy vinyl ester compound to introduce unsaturated double bonds and achieve ultrahigh sensitivity, then sensitivity to actinic energy rays is improved, but acid groups are consumed and alkali developability deteriorates
Solution Approach 1:
The invention changes the chemical parameters by using a polybasic anhydride with specific basicity to react with the epoxy group-containing monomer, controlling the degree of reaction to maintain sufficient acid groups while introducing enough unsaturated double bonds for high sensitivity
Solution Approach 2:
The invention creates a composite resin system combining the modified epoxy vinyl ester compound with a photopolymerization initiator, where the composite structure allows simultaneous achievement of high sensitivity through the unsaturated double bonds and good alkali developability through the remaining acid groups
2Measurement precision
If the epoxy group-containing radically-polymerizable unsaturated monomer is blended with the vinyl ester resin to provide ultrahigh sensitivity, then sensitivity is improved, but the development rate is remarkably lowered and the heat control range becomes extremely narrow
Solution Approach 1:
The invention optimizes the chemical composition parameters by controlling the molar ratio of polybasic anhydride to epoxy group-containing monomer, and the acid value of the resulting resin, to achieve a balance between sensitivity enhancement and maintaining broad heat control range for predrying
3Measurement precision
If the level of modification with epoxy group-containing radically-polymerizable unsaturated monomer is increased to achieve ultrahigh sensitivity, then sensitivity is improved, but alkali developability and heat control range deteriorate due to inverse proportionality between acid value and number of unsaturated double bonds
Solution Approach 1:
The invention establishes specific parameter ranges: acid value of 10-150 mg KOH/g and 1.5-4.0 unsaturated double bonds per aromatic ring, which optimizes the inverse relationship between acid content and double bond content to simultaneously achieve ultrahigh sensitivity and maintain developability
Solution Approach 2:
The invention uses a photopolymerization initiator system that copies the high sensitivity effect through photoinitiated polymerization of the unsaturated double bonds, allowing the resin to achieve ultrahigh sensitivity without excessive modification that would harm developability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits ultrahigh sensitivity to actinic energy rays, enabling effective curing with low exposure energy, maintaining excellent alkali developability, and a broad heat control range, resulting in improved drying properties and a balanced set of properties like adhesiveness and chemical resistance in the cured film.
Implementation Method 1
a photopolymerization initiator (B); wherein the acid group-containing vinyl ester resin (A) is an acid group-containing vinyl ester resin having a multiple-branched molecular structure
Data Source
AI summary
A photosensitive resin composition of the present invention includes an acid group-containing vinyl ester resin and a photopolymerization initiator as essential components, wherein the acid group-containing vinyl ester resin is an acid group-containing vinyl ester resin having a multiple-branched molecular structure obtained by the following steps where a polybasic anhydride (a3) is reacted with an epoxy vinyl ester resin (v1) that is a reaction product of an aromatic epoxy resin (a1) and a radically-polymerizable unsaturated-double bond-containing monocarboxylic acid (a2); a radically-polymerizable unsaturated-double bond-containing monoepoxy compound (a4) is subsequently reacted with an acid group formed by the reaction; and a polybasic anhydride (a3) is subsequently reacted with a secondary hydroxyl group formed by the reaction of the compound (a4) with the acid group, thereby obtaining the acid group-containing vinyl ester resin having a multiple-branched molecular structure; and contains 1.75 to 3.5 radically-polymerizable unsaturated double bonds per aromatic ring in the acid group-containing vinyl ester resin, and the acid groups within a range where the acid value of the acid group-containing vinyl ester resin reaches 30 to 150 mg KOH/g. According to the present invention, a resin composition for a resist ink that simultaneously has ultrahigh sensitivity, excellent developability, and broad heat control range can be provided.