Photosensitive Resin Composition for High Sensitivity and Etching Resistance
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Solution Overview
Problem
Photosensitive resin compositions struggle to achieve both high sensitivity for rapid exposure and excellent etching solution resistance, with compositions having excellent sensitivity often failing to maintain integrity during etching processes.
Innovation Solution
A photosensitive resin composition incorporating a polyfunctional compound with three or more ethylenically unsaturated bonds, specifically 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, and an acridine compound, optimized for exposure doses of 30 mJ/cm2 or less, to enhance both sensitivity and etching solution resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a photosensitive resin composition is designed to have excellent sensitivity for rapid exposure, then productivity is improved by shortening takt time, but the cured product fails to maintain etching solution resistance and peels off during etching
Solution Approach 1:
The patent applies parameter changes by carefully controlling the exposure dose to 30 mJ/cm2 or less, which optimizes the polymerization reaction to achieve both high sensitivity and etching solution resistance. This specific parameter range allows the cured product to maintain integrity during etching while enabling rapid exposure processing
Solution Approach 2:
The patent uses a composite photopolymerizable compound system combining compounds with different functional groups (carboxyl, hydroxyl, amine groups) in specific proportions. This composite approach creates a cured product with enhanced crosslinking density and network structure that provides both rapid curing at low exposure doses and excellent resistance to etching solutions
2Loss of time
If the exposure dose is reduced to improve sensitivity, then takt time is shortened, but the cured product loses etching solution resistance
Solution Approach 1:
The patent establishes a specific exposure dose parameter range of 30 mJ/cm2 or less that simultaneously achieves rapid processing and maintains etching solution resistance. This optimized parameter prevents under-curing that would compromise etching resistance while enabling fast exposure
Solution Approach 2:
The patent creates local quality differences in the cured product structure through controlled polymerization, where the crosslinked network provides localized density and chemical resistance properties that maintain etching solution resistance even at low exposure doses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent sensitivity while ensuring a cured product with robust etching solution resistance, effectively preventing peeling during metal layer etching processes.
Implementation Method 1
a photopolymerizable compound, and a photopolymerization initiator, in which the component (B) includes a polyfunctional compound having three or more ethylenically unsaturated bonds
Data Source
AI summary
A photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, in which the component (B) includes a polyfunctional compound having three or more ethylenically unsaturated bonds, and in a case where development is performed after exposing a layer (thickness 25 μm) of the photosensitive resin composition at a wavelength of 405 nm using a 41-step tablet (concentration region 0.00 to 2.00, concentration step 0.05, tablet size 20 mm×187 mm, each step size 3 mm× 12 mm), an exposure dose providing 15 steps as the number of remaining steps is 30 mJ/cm2 or less.