Photosensitive Resin Composition for High-Frequency Wiring
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Solution Overview
Problem
Existing photosensitive resin compositions for miniaturized wiring structures require high-temperature heat treatment for curing, leading to pattern deformation and film loss issues, and fail to provide the necessary low dielectric properties for high-frequency applications.
Innovation Solution
A photosensitive resin composition comprising a modified polyphenylene ether resin, a silsesquioxane compound, and a photopolymerization initiator, cured using active energy rays, which maintains pattern accuracy and reduces film loss, while achieving low dielectric constants and loss tangents for high-frequency applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature heat treatment is performed for curing the photosensitive resin composition, then the resin is cured, but the formed pattern is deformed due to shrinkage
Solution Approach 1:
The patent replaces thermal curing (heat treatment) with photochemical curing (UV irradiation). The photosensitive resin composition contains a photopolymerization initiator that activates upon UV irradiation to cure the resin without requiring high-temperature heat treatment, thereby eliminating thermal shrinkage and pattern deformation while achieving complete curing.
Solution Approach 2:
The patent changes the curing parameter from temperature (thermal energy) to wavelength of light (photochemical energy). By formulating a resin composition sensitive to UV irradiation rather than heat, the curing process occurs at ambient or low temperatures, preserving pattern geometry while ensuring complete polymerization through photopolymerization initiator activation.
2Productivity
If the line and space is reduced to 2 μm/2 μm or less for miniaturized wiring, then wiring density is increased, but pattern deformation becomes more serious
Solution Approach 1:
The patent replaces thermal curing with photochemical curing to eliminate the shrinkage mechanism that causes pattern deformation. This substitution enables the formation of miniaturized patterns at 2 μm/2 μm L/S without the thermal stress and contraction that would otherwise严重 distort such fine features, thereby maintaining wiring density while preserving pattern accuracy.
Solution Approach 2:
The patent uses UV irradiation that can be precisely controlled in intensity and distribution. By applying the appropriate amount of UV energy (excessive action), complete curing is achieved throughout the thin resin layer at 2 μm/2 μm L/S, ensuring full polymerization and pattern stability without the gradual thermal diffusion that causes deformation in conventional heat curing.
3Reliability
If conventional photosensitive resin composition is used, then the resin can be cured, but film loss occurs in the development process
Solution Approach 1:
The patent replaces thermal curing with photochemical curing to achieve complete and uniform polymerization throughout the resin film. The photopolymerization initiator ensures rapid and thorough crosslinking upon UV irradiation, creating a fully cured network that resists dissolution during development, thereby eliminating film loss while maintaining curing capability.
Solution Approach 2:
The patent ensures continuous and complete photopolymerization throughout the resin layer by using a photopolymerization initiator system that activates uniformly upon UV irradiation. This continuous curing action throughout the entire film thickness creates a uniformly crosslinked structure that maintains film integrity during development, preventing the partial curing and subsequent film loss seen in conventional systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for accurate miniaturization of patterns down to 2 μm/2 μm, prevents pattern deformation, and exhibits excellent electrical properties with low dielectric constants and loss tangents, enabling efficient high-frequency signal transmission without the need for high-temperature heat treatment.
Implementation Method 1
a photopolymerization initiator... cured by irradiation with active energy rays
Implementation Method 2
exhibits excellent electrical properties with low dielectric constants and loss tangents, enabling efficient high-frequency signal transmission
Data Source
AI summary
There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.