Photosensitive Resin Molds for Thick Conductive Patterns
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Solution Overview
Problem
Existing methods for forming conductive patterns, such as the subtractive and semi-additive methods, face challenges in creating thick conductive patterns due to issues like side etching, adhesiveness problems, and instability, leading to form abnormalities such as breakage, peeling, and dimensional variations.
Innovation Solution
A method involving a laminate with a transparent substrate, a light shielding pattern, and a negative tone photosensitive resin layer is used, where the resin layer is developed to form a mold, and a conductive pattern is formed on this mold through electroplating, reducing form abnormalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick conductive pattern is formed to reduce electric resistance, then the electric resistance decreases, but side etching occurs causing form abnormalities
Solution Approach 1:
The patent applies preliminary action by forming a resin pattern before forming the conductive pattern. The resin pattern is created through photolithography (exposing and developing a photosensitive resin layer) to define the precise shape and position where the conductive pattern should be formed. This pre-formed resin pattern serves as a template that guides subsequent electroless plating and etching processes, ensuring that even thick conductive patterns are formed with accurate dimensions and without side etching abnormalities.
Solution Approach 2:
The patent uses an intermediary approach by introducing a resin pattern as a mediating structure between the substrate and the conductive pattern. This resin pattern acts as a mask and form-defining layer during the electroless plating process. The resin pattern protects areas where conductive material should not be deposited and guides the deposition process to form thick conductive patterns with precise boundaries, preventing the side etching problem that occurs when trying to form thick patterns directly without such intermediary guidance.
2Ease of manufacture
If the subtractive method is used to form conductive patterns, then the process is simple, but side etching causes form abnormalities
Solution Approach 1:
The patent inverts the conventional subtractive approach by using an additive-electroless plating method. Instead of depositing a thick conductive layer and then etching away excess material (which causes side etching), the process forms the conductive pattern by selective deposition onto a resin pattern template. This inverted approach eliminates the side etching problem while maintaining manufacturing simplicity, as the resin pattern directly defines the final conductive pattern shape without requiring complex etching control.
3Manufacturing precision
If the semi-additive method is used to form conductive patterns, then thick patterns can be formed, but adhesiveness between seed layer and resist pattern causes instability
Solution Approach 1:
The patent applies parameter changes by modifying the material composition and properties of the resin pattern to optimize adhesiveness. The resin pattern is formulated with specific chemical components and physical properties that enhance bonding with the electroless plating layer. Additionally, the surface treatment and chemical composition of the resin pattern are controlled to ensure stable adhesion during the electroless plating process, allowing thick conductive patterns to be formed without the instability and peeling issues that occur in conventional semi-additive methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of thick conductive patterns with reduced form abnormalities, enhancing the stability and consistency of the conductive patterns.
Implementation Method 1
a negative tone photosensitive resin layer which is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; developing the negative tone photosensitive resin layer to form a resin pattern
Implementation Method 2
forming a conductive pattern on the light shielding pattern
Data Source
AI summary
The present disclosure provides a method of manufacturing a conductive pattern and applications thereof, the method including: a step of preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; a step of irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; a step of developing the negative tone photosensitive resin layer to form a resin pattern in a region defined by the transparent substrate and the light shielding pattern; and a step of forming a conductive pattern on the light shielding pattern.