Negative Photosensitive Resin Composition for Crack-Resistant Fine Patterning
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Solution Overview
Problem
Existing insulating films in semiconductor components face challenges in achieving high resolution and miniaturization without generating cracks due to mechanical stress, requiring improved mechanical strength and elongation at break.
Innovation Solution
A negative photosensitive resin composition comprising a polyhydroxyamide compound, a photoacid generator, a crosslinking agent, and a low molecular weight phenol compound with specific content ratios, enhancing elongation at break while maintaining dissolution contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pattern is miniaturized to achieve higher integration and finer patterning, then resolution is improved, but cracks may be generated in the cured film when slight stress is applied
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive resin by incorporating a polyhydroxyamide compound with specific molecular weight and hydroxyl group content, along with a phenol compound and crosslinking agent in controlled ratios. This parameter optimization enables the cured film to achieve both high resolution for miniaturized patterns and sufficient mechanical strength to prevent cracks under stress.
Solution Approach 2:
The patent creates a composite material system combining polyhydroxyamide compound (A), phenol compound (B), crosslinking agent (C), and photoacid generator (D). This composite formulation synergistically provides the dual functionality of high resolution for fine patterning and enhanced mechanical strength to prevent crack formation during miniaturization processes.
2Strength
If the content of crosslinking agent is increased to improve mechanical strength, then elongation at break is improved, but dissolution contrast (γ value) may be impaired
Solution Approach 1:
The patent precisely controls the content parameters of each component, specifying that the phenol compound (B) should be 0.01-30 parts by mass per 100 parts by mass of polyhydroxyamide compound (A), and the crosslinking agent (C) should be 1-50 parts by mass per 100 parts by mass of polyhydroxyamide compound (A). This parameter optimization ensures both improved elongation at break and maintained dissolution contrast.
Solution Approach 2:
The polyhydroxyamide compound acts as an intermediary between the phenol compound and crosslinking agent, facilitating a balanced crosslinking network formation. This intermediary role allows the system to achieve enhanced mechanical strength through controlled crosslinking while maintaining the dissolution properties necessary for high γ value and resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured product with improved elongation at break, reducing crack formation during miniaturization without compromising resolution.
Implementation Method 1
a compound that generates an acid by irradiation with radiation
Implementation Method 2
a compound capable of crosslinking the specific polyamide derivative
Data Source
AI summary
Provided is a negative photosensitive resin composition capable of providing a cured product having better elongation at break without impairing dissolution contrast (γ value) which is a measure of resolution of the negative photosensitive resin composition. Provided is a negative photosensitive resin composition containing a polyhydroxyamide compound (A), a photoacid generator (B), a crosslinking agent (C), and a phenol compound having two or more hydroxy groups (D), wherein the phenol compound having two or more hydroxy groups (D) has a molecular weight of 1,000 or less, and the content of the phenol compound having two or more hydroxy groups (D) is 0.01 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the solid content of the polyhydroxyamide compound (A).